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AMOLED packaging structure and manufacturing method thereof

A packaging structure and manufacturing method technology, applied in the field of microelectronics, can solve problems such as circuit damage, panel scrapping, Al melting, etc., and achieve the effects of saving production material costs and production capacity, and preventing damage

Pending Publication Date: 2019-10-18
FUJIAN HUAJIACAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current Laser Sealing process will focus the laser on the Frit, but because the laser energy has radiation characteristics, the laser energy will radiate to the circuit below the Frit, and the temperature during laser sintering can reach a high temperature of about 800°C to 1000°C, while the OLED panel The peripheral driving circuit is usually made of Al as the main material, and the melting point of Al is 660.4°C. Therefore, the LaserSealing process can easily cause Al to melt and cause damage to the circuit, resulting in the scrapping of the panel.

Method used

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  • AMOLED packaging structure and manufacturing method thereof
  • AMOLED packaging structure and manufacturing method thereof

Examples

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Embodiment 1

[0051] Please refer to figure 1 , Embodiment 1 of the present invention is:

[0052] An AMOLED packaging structure, comprising a backplane glass 1, an array film layer 2, an organic layer 3, an organic flat layer 4 and a cover glass 5 are sequentially stacked on the surface of the backplane glass 1;

[0053] The organic flat layer 4 is provided with an opening, and the opening is filled with a metal layer 6 and a frit glue layer 7, and the frit glue layer 7 and the metal layer 6 are sequentially arranged on the surface of the organic layer 3, and the frit glue layer A side of the layer 7 away from the back glass 1 is in contact with a side of the cover glass 5 close to the back glass 1 .

[0054] The array film layer 2 is provided with driving lines.

[0055] The thickness of the metal layer 6 is 1.5-2.2 μm, preferably 1.8 μm.

[0056]The metal layer 6 is a titanium metal layer. In the actual manufacturing process, for the selection of the metal material of the metal layer,...

Embodiment 2

[0058] Please refer to figure 2 , the second embodiment of the present invention is:

[0059] A method for manufacturing an AMOLED packaging structure, comprising the following steps:

[0060] S1. Provide a backplane glass 1, and the surface of the backplane glass 1 is covered with an array film layer 2;

[0061] S2, forming an organic layer 3 and covering the surface of the array film layer 2;

[0062] S3, forming an organic planar layer 4, and covering the surface of the organic layer 3, forming an opening in the organic planar layer 4;

[0063] S4, forming a metal layer 6 in the opening, the metal layer 6 covering the surface of the organic layer 3;

[0064] S5, forming a frit adhesive layer 7, and covering the surface of the metal layer 6;

[0065] S6, forming a cover glass 5, covering the surface of the organic flat layer 4 and contacting the side of the frit glue layer 7 away from the back glass 1;

[0066] S7 , providing laser light to irradiate the cover glass 5 ...

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Abstract

The invention relates to the field of micro electronic technique, in particular to an AMOLED packaging structure and a manufacturing method thereof. The AMOLED packaging structure comprises backing plate glass, an array film, an organic layer, an organic flat layer and cover plate glass, wherein the array film, the organic layer, the organic flat layer and the cover plate glass are arranged on thesurface of the backing plate glass in sequence. A metal layer is arranged under a frit glue layer, and the damage of a peripheral drive circuit caused by a laser sealing process can be prevented effectively, so that the yield of the product is improved so as to reduce the production cost.

Description

technical field [0001] The invention relates to the field of microelectronic technology, in particular to an AMOLED packaging structure and a manufacturing method thereof. Background technique [0002] The active-matrix organic light-emitting diode (AMOLED) process is mainly divided into two main processes: evaporation and packaging. The main purpose of packaging is to isolate external water vapor and oxygen from the organic light-emitting diode. (Organic Light-Emitting Diode, abbreviated as OLED) panels to ensure the life of the OLED organic film. The packaging process currently includes Frit, tetrafluoroethylene (TFE), Dam and Filler, etc. At present, the Frit process is commonly used in rigid AMOLED, mainly using the screen printing process to print Frit on the cover glass, and after the packaging equipment and the backplane are laminated, the laser sealing (Laser Sealing) process is used to use laser sintering technology to sinter the Frit to achieve the purpose of iso...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/52H01L51/56
CPCH10K59/12H10K59/126H10K50/841H10K59/1201H10K71/00
Inventor 罗云鹏
Owner FUJIAN HUAJIACAI CO LTD