Transferable flexible electrode and preparation method and application thereof

Abstract

The invention belongs to the technical field of organic electroluminescent devices, in particular to a transferable flexible electrode and a preparation method and application thereof, and provides the preparation method of the transferable flexible electrode. The preparation method comprises the following steps: (1) coating a photoresist, a PDMS layer and a laminated sheet graphite on a substratein sequence to obtain a primary electrode; (2) removing the photoresist of the primary electrode in the step (1) so that the substrate is stripped and annealing the remaining PDMS layer and the sheetgraphite so as to obtain the transferable flexible electrode. The problem that the traditional flexible electrode material needs to be fixed on the substrate and cannot be transferred can be solved so that the technical effect of separating the flexible electrode material from the substrate can be realized and the use scheme of the flexible electrode can be enriched. The experiment shows that thetransferable flexible electrode has excellent mechanical bending performance, air stability and heat dissipation performance.

Description

technical field [0001] The invention belongs to the technical field of organic electroluminescent devices, and in particular relates to a transferable flexible electrode and its preparation method and application. Background technique [0002] Organic electronic devices are semiconductor devices with specific functions prepared on the basis of conductive organic materials. Since most of the organic materials in organic electronic devices are composed of carbon and hydrogen, using them to make electronic devices has many advantages, such as easy fabrication, low cost, chemical adjustment, transparency and flexibility, etc. Flexible organic light-emitting devices can be used in display technology. With their outstanding advantages such as light weight, high efficiency, easy processing and deformability, they are suitable for use in wearable devices, plastic bioelectronics and prosthetic electronic skin, and will be commercialized in the next generation Display market realizes...

AI Technical Summary

Problems solved by technology

Usually, the optional flexible substrates mainly include ultra-thin glass, metal foil, etc., but the flexibility of ultra-thin glass is not good, fragile, and the cost is high, the preparation is difficult, and ultra-thin glass cannot be used alone in the flexible packaging process. In use, polymer coating is required to protect the glass surface from mechanical damage and chemical reagent erosion, and the epoxy resin sealing technology at the edge cannot meet the requirements; the surface of the metal foil substrate is rough and needs to be planarized, and it is light-transmitting The performance is extremely poor, and the device can only adopt the top-emission structure that emits light from the upper part of the ultra-thin transparent electrode, which is not very practical.

[0004] Considering the brittleness and poor packaging performance of common flexible substrates, some new flexible substrates can solve some shortcomings of high brittleness and poor packaging performance. However, it is difficult to directly prepare flexible electrodes on new flexible substrates.

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