High-precision ultrathin sheet overlapping, stacking and connecting machine and overlapping and connecting method thereof

A connection method and ultra-thin sheet technology, which are applied in multilayer circuit manufacturing, electrical components, printed circuit manufacturing, etc., to achieve the effects of reducing material loss, improving adjustment efficiency, and ensuring yield
CN110351966APending Publication Date: 2019-10-18JIANGSU XINTIMU INTELLIGENT EQUIP CO LTD +1
0 Cites 2 Cited by

Patent Information

Authority / Receiving Office
CN ยท China
Current Assignee / Owner
JIANGSU XINTIMU INTELLIGENT EQUIP CO LTD
Publication Date
2019-10-18

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses a high-precision ultrathin sheet overlapping, stacking and connecting machine and an overlapping and connecting method thereof. The high-precision ultrathin sheet overlapping and connecting machine comprises a first sheet positioning jig, a second sheet positioning jig, a third sheet positioning jig, a first transferring device and a second transferring device. According tothe scheme, a fixed positioning pin and a movable positioning pin are respectively arranged on the plurality of jigs, so that the movable positioning pin is connected with a micrometer, the positionof the movable positioning pin can be accurately determined through the micrometer, and the position precision of the movable positioning pin is greatly ensured; meanwhile, during the subsequent adjustment of the movable positioning pin, the adjustment can be carried out by referring to micrometer data of a previous jig, thereby facilitating the improvement of the adjustment efficiency of the movable positioning pin, or the adjustment of the movable positioning pins of the jigs. Therefore, the mutual verification can be carried out through micrometer data of the positioning jigs, and a technical guarantee is provided for overlapping and stacking of multiple layers of materials.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to lamination equipment, in particular to a high-precision superthin sheet overlapping and connecting machine and a laminating and connecting method thereof. Background technique

[0002] The main function of PCB lamination is to laminate the inner layer board, PP film, and copper foil in a certain order, and then bond them together through high temperature and high pressure to make it a four-layer board or multi-layer board. When the PP film bonds the inner board and the copper foil through high temperature and high pressure, for example, in the field of soft and hard bonded board manufacturing, there are PP films with the same window shape and size and a thickness of tens of microns that are laminated and connected with FCCL. Together, this operation method requires 4 people to operate manually, of which 2 people clean the PP film (to avoid PP powder residue and cause defects), and 1 person needs to use PIN nails to connect the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More