Mold heating device

A mold heating and heating cavity technology, applied in the field of mold processing, can solve the problems of uneven heating of the mold, low quality of molded products, and low work efficiency, and achieve effective mold maintenance, good precision, and reduced color unevenness.

Inactive Publication Date: 2019-10-22
MAANSHAN NIUZE TECH SERVICE
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional mold heating device is easy to cause uneven heating of the molds, and it can only be heated one by one, and the work efficiency is not high; sometimes the mold takes a long time to enter the heating chamber, and the temperature is lower than the set temperature when entering the heating chamber , resulting in low quality molded products

Method used

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Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0020] see Figure 1-3 , the present invention provides a technical solution: a mold heating device, including a body 1, an insulation layer 2 is provided inside the body 1, a heating chamber 3 is provided inside the body 1, and the heating chamber 3 is connected to the left side of the body 1 through a feed pipe. The feeding port 4 is connected, the top of the body 1 is provided with a heat dissipation port 5, the heat dissipation port 5 is provided with a h...

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Abstract

The invention discloses a mold heating device, which comprises a device body. A heat preservation layer is arranged on the inner side of the device body, and a heating cavity is formed in the device body and communicates with a charging opening in the left side of the device body through a feeding pipeline; a heat dissipation opening is formed in the top of the device body, and a heat dissipationfan is arranged at the heat dissipation opening; a plurality of silicon molybdenum bars are arranged on the periphery and at the bottom of the heating cavity, and a thermocouple is arranged on one side of the heating cavity and connected with a temperature control meter which is arranged on the device body; the device body is externally connected with a control cabinet, and universal wheels are arranged at the bottom of the device body; the bottom in the heating cavity is connected with a tray through a rotating shaft, and the tray is in a hollowed-out shape; the rotating shaft is connected with a rotating motor, and the rotating motor is mounted at the bottom of the device body; heat conducting pipes are arranged on the two sides outside the heating cavity and are each in a U shape, and the heat conducting pipes on the two sides are connected with the heat dissipation opening and provided with heat insulation layers; and heat dissipation sheets are arranged on the heat insulation layers, and a discharging outlet is formed in the other side of the heating cavity. Heating distribution in the heating cavity is uniform, mold heating is full and uniform, water vapor can be effectivelyremoved, and the heating efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of mold processing, in particular to a mold heating device. Background technique [0002] Mold heating is widely used in various industries such as plastic molding, light guide plate die-casting, rubber tires, rollers, open mills, and internal mixing. The traditional mold heating device is easy to cause uneven heating of the molds, and it can only be heated one by one, and the work efficiency is not high; sometimes the mold takes a long time to enter the heating chamber, and the temperature is lower than the set temperature when entering the heating chamber , resulting in low quality molded products. Contents of the invention [0003] The object of the present invention is to provide a mold heating device to solve the problems raised in the background art above. [0004] In order to achieve the above object, the present invention provides the following technical solutions: a mold heating device, includin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C35/02B29C33/00
CPCB29C33/00B29C35/02B29C2035/0211
Inventor 龚建全
Owner MAANSHAN NIUZE TECH SERVICE
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