A kind of processing method of brazed soaking plate
A processing method and technology of soaking plate, applied in indirect heat exchangers, heat exchange equipment, heat exchanger shells, etc., can solve the problems of troublesome processing, heavy weight, high material and processing costs, and reduce the cost of materials and processing. The effect of cost, weight reduction, convenient processing method
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Embodiment 1
[0047] Please refer to image 3, in this embodiment, the two boards 1 are an aluminum board 11 and an aluminum-based composite board 12 , and the cladding layer 4 on the aluminum-based composite board 12 is located on the side close to the aluminum board 11 . The filler 2 is particulate matter, specifically copper powder and / or ceramic powder particles and / or hydrated aluminosilicate, the particle size of which is 25-100 mesh, and the matrix 3 in the aluminum matrix composite board 12 The melting point is 630-660°C, the melting point of the cladding layer 4 is 580-610°C, the melting point of the filler 2 in this embodiment is higher than 800°C, and the melting point of the cladding layer 4 is about 50°C lower than that of the substrate 3 . After the aluminum-based composite board 12 is stamped and the groove 5 is formed, the aluminum board 11 is placed above the aluminum-based composite board 12, the particles are put into the groove 5, and the aluminum board 11 and the alumin...
Embodiment 2
[0049] The difference between this embodiment and the first embodiment is that the filler 2 further includes an adhesive and / or a foaming agent, and the melting point of the particles is higher than the brazing temperature. Wherein the volume ratio of the binder and / or foaming agent to the filler 2 is 5-20%. After brazing, it is easier for the particles to cooperate with the adhesive and / or the foaming agent to form sintered particles attached to the inner surface of the closed cavity 6 , thereby forming the capillary structure 7 .
Embodiment 3
[0051] The difference between this embodiment and Embodiment 1 is that the filler 2 includes first particles and second particles, the melting point of the first particles is higher than the brazing temperature, and the melting point of the second particles is lower than the brazing temperature. soldering temperature. Specifically, the first particle is copper powder, alumina, silicon dioxide or a mixture thereof, the particle size of the first particle is 25-100 mesh, and the melting point is higher than 800°C. The second particle is an aluminum-silicon alloy particle, wherein the silicon content is 3-10%, the particle size of the second particle is 100-200 mesh, and the melting point is 580-620°C. The first particle and the second particle The volume ratio is 3:1-10:1. In this embodiment, the second particle with a smaller particle size and low melting point is mixed with the first particle with a larger particle size and a high melting point. After brazing, the second part...
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