Wafer state detection device and method and wafer loading and unloading chamber

Abstract

The invention provides a wafer state detection device and method and a wafer loading and unloading chamber. The device comprises a first sensor group, a second sensor group and a control device, wherein the first sensor group includes a first transmitting sensor and a second receiving sensor, the first transmitting sensor transmits a first light beam to the first receiving sensor, and the first light beam is parallel to the plane in which wafer placing positions of a wafer box are located; the second sensor group includes a second transmitting sensor and a second receiving sensor, the second transmitting sensor transmits a second light beam to the second receiving sensor, and a preset included angle is formed between the second light beam and the first light beam; and the control device acquires the state of a wafer at each wafer placing position according to the signal data transmitted by the first receiving sensor and the second receiving sensor. The distribution state of the waferswith different thicknesses can be effectively and accurately detected by adopting the device.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a wafer state detection device and method, and a wafer loading and unloading chamber. Background technique [0002] At present, in the production process of semiconductor integrated circuits, in order to ensure the efficiency and precision of processing, manipulators are usually used to pick, place and transfer wafers. Specifically, the manipulator control program can formulate the stroke of the manipulator according to the position of the wafer in the wafer cassette (or other container for placing wafers), so as to realize the accurate transfer of the wafer, so the distribution of the wafer in the wafer cassette State data is the key factor to determine whether the manipulator can pick and place wafers accurately. In order to ensure that the manipulator can pick and place wafers normally, the distribution of wafers in the wafer cassette can be detected before the manip...

AI Technical Summary

Problems solved by technology

However, in the actual detection process, when the diameter of the laser beam is larger than the thickness of the wafer, the wafer under test cannot block the scanning beam in the effective scanning area and cannot cause signal changes; Under normal circumstances, in the effective scanning area, the wafer under test blocks the scanning beam for a long time, and the normal change of the signal cannot be caused. In these two cases, the distribution state of the wafer cannot be detected correctly.

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