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MEMS device and preparation method thereof

A device and substrate technology, applied in the field of MEMS devices and their preparation, can solve problems such as reducing the service life and performance of MEMS devices, damage life, rupture, etc., and achieve good mechanical properties, improve service life, and improve bearing capacity.

Active Publication Date: 2019-10-22
SEMICON MFG INT (SHANGHAI) CORP +1
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Problems solved by technology

[0004] However, when performing reliability tests such as steam blowing tests on MEMS devices, when the air enters the gap through the back cavity, it will directly act on the vibrating membrane. The problem of damage or even cracking reduces the service life and performance of MEMS devices
In addition, when the sound enters from the back cavity, there are also the above-mentioned problems of damage and short life

Method used

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  • MEMS device and preparation method thereof
  • MEMS device and preparation method thereof
  • MEMS device and preparation method thereof

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preparation example Construction

[0064] In view of the above problems, the inventors of the present application proposed a method for preparing a MEMS device, including: providing a substrate, the substrate has a front and a back; forming a vibrating membrane on the front of the substrate, and the vibrating membrane has exposed One or more slits in part of the base; a pole plate is formed on the vibrating membrane, the pole plate is insulated from the vibrating membrane and a gap is formed between the two, and a pole plate is formed in the vibrating membrane There are a first through hole and a second through hole communicating with the gap, and the second through hole and the slit have a facing area, and the first through hole and the slit are completely staggered; The back side of the substrate forms a back cavity exposing the diaphragm and facing away from the gap.

[0065] In the preparation method of the MEMS device provided by the present invention, one or more slits exposing the base are formed in the ...

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Abstract

The invention provides an MEMS device and a preparation method thereof. The MEMS device is characterized in that one or more slits exposing a substrate are formed in a vibrating diaphragm, and a second through hole which is communicated with the gap and has a right opposite area with the slit is formed in a polar plate; when a reliability test such as a steam blowing test is carried out on the MEMS device, gas is introduced from a back cavity, and one part of the gas flows out from the second through hole through the slit, so that the pressure applied to the vibrating diaphragm is reduced, and the bearing capacity of the vibrating diaphragm is correspondingly improved, and the service life of the MEMS device is prolonged; moreover, one or more slits are formed in the vibrating diaphragm,so that the amplitude of the vibrating diaphragm in the vibrating process can be increased, and the sensitivity and the signal-to-noise ratio of the MEMS device are improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a MEMS device and a preparation method thereof. Background technique [0002] MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) technology refers to a micro-system that can integrate mechanical components, drive components, optical systems, and electronic control systems into a whole. It uses microelectronics technology and micromachining technology ( Such as silicon body micromachining, silicon surface micromachining, wafer bonding, etc.) combined manufacturing process, to produce a variety of excellent performance, low price, miniaturized sensors (such as inertial sensors, pressure sensors, acceleration sensors, etc.), execution drives, drives and microsystems. [0003] Existing MEMS devices generally include a base, the base has a front and a back, and the base has a back cavity that runs through the front and the back, a vibrating membrane is for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R31/00H04R19/00
CPCH04R19/005H04R31/003H04R2201/003H04R2231/001
Inventor 李鑫郭亮良
Owner SEMICON MFG INT (SHANGHAI) CORP
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