A spring-type dual-circulation supercomputer cooling system

Abstract

The invention relates to a fountain type double-circulation supercomputer cooling system, which comprises a subcooler, a circulating pump, a blade case, a condenser, a secondary cooling system, a pipeline and a valve, and is characterized in that an evaporative cooling medium is stored in the subcooler, the blade case and the connected pipeline. The cooling system is divided into two communicatedcycles. The steam in the blade case rises to the condenser through a collecting pipe and a collecting valve and is condensed into a liquid, and the liquid flows into the blade case via a liquid returnpipe to realize self circulation of the steam; and the high-temperature medium in the blade case enters the subcooler via an overflow pipe and then flows into the blade case via a liquid inlet pipe after being cooled so as to realize the controllable circulation of the evaporative cooling medium. The cooling system carries out heat exchange by medium phase change and forced convection, and well solves the problem of difficult heat dissipation of equipment. The cooling system is energy-saving and environment-friendly, has no electromagnetic radiation, no dust pollution and low noise to the outside. In addition, the cooling system is low in operation cost and high in heat dissipation efficiency, and can improve the equipment placement density and improve the utilization rate of a computer room.

Description

technical field [0001] The invention relates to a supercomputer cooling system, in particular to a spring-type dual-circulation supercomputer cooling system. Background technique [0002] With the continuous development of electronic technology, the integration of circuits is getting higher and higher, and the CPU, the core component of the computer, has become the core area where heat is highly concentrated. High heat will cause unstable system operation, shorten the life of integrated circuits, and damage devices, which will seriously affect the normal operation of the computer. The traditional air-cooled heat dissipation method can no longer meet the requirements of high-density supercomputers, and the heat dissipation problem has become a major bottleneck restricting the development of computers. At the same time, when the traditional cooling method is adopted, the energy consumption for cooling the data center will account for 30% to 40% of the total energy consumption...

AI Technical Summary

Problems solved by technology

The pipeline of the system is complicated, the cost is high, and it is easy to leak. The pulsating pressure of the spray will cause poor contact of the connectors. The uneven spray will cause the local distribution capacitance of the circuit board to change, which will affect the working stability of the high-frequency circuit, and will be damaged in severe cases. components

[0005] The immersion self-circulation evaporative cooling system immerses the components in the medium. Due to the small heat exchange area and slow liquid flow, the heat exchange effect is poor, and the heat of the high-power multi-core CPU is difficult to transfer out.

At the same time, the ambient temperature will also have a great impact on the heat dissipation of the system.

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