Full-spectrum LED lamp bead and production method thereof
A LED lamp bead, full-spectrum technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of high cost, high price of phosphor powder, and inability to mass-produce, etc., to achieve the effect of high brightness and energy saving
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Embodiment 1
[0019] First install the LED chip on the substrate, then install the substrate on the reflective cup, and apply the mixture of epoxy resin and silica gel on the LED chip. The mass ratio of epoxy resin: silica gel is 5:23-27, so that the silica gel layer Cover the LED chip completely, weigh and quantify the above-mentioned four-component mixed phosphor powder, mix it fully and disperse it in the silica gel, then place it in a centrifugal vacuum defoaming machine for defoaming treatment, and then apply the above-mentioned silica gel mixed system to the LED The surface of the chip, and use a centrifugal precipitator to evenly precipitate the fluorescent powder on the chip, put the above semi-finished LED lamp into the dryer and dry it at 100°C for 1 hour, and then dry it at 150°C for 3 hours to finally get the LED lamp bead sample , and then the LED lamp bead sample was subjected to an electric light source test in an environment with an ambient temperature of 25.3°C and an ambien...
Embodiment 2
[0021] First install the LED chip on the substrate, then install the substrate on the reflective cup, and apply the mixture of epoxy resin and silica gel on the LED chip. The mass ratio of epoxy resin: silica gel is 5:23-27, so that the silica gel layer Cover the LED chip completely, weigh and quantify the above-mentioned four-component mixed phosphor powder, mix it fully and disperse it in the silica gel, then place it in a centrifugal vacuum defoaming machine for defoaming treatment, and then apply the above-mentioned silica gel mixed system to the LED The surface of the chip, and use a centrifugal precipitator to evenly precipitate the fluorescent powder on the chip, and then put the above semi-finished LED lamp into the dryer and dry it at 95°C for 1 hour, and then dry it at 155°C for 3 hours, and finally get the LED lamp Bead samples, and then the LED lamp bead samples were subjected to electric light source testing in an environment with an ambient temperature of 25.3°C a...
Embodiment 3
[0023] First install the LED chip on the substrate, then install the substrate on the reflective cup, and apply the mixture of epoxy resin and silica gel on the LED chip. The mass ratio of epoxy resin: silica gel is 8:35, so that the silica gel layer will cover the LED The chip is completely covered, weigh and quantify the above-mentioned 4-component mixed fluorescent powder, mix it fully and disperse it in the silica gel, then place it in a centrifugal vacuum defoaming machine for defoaming treatment, and then apply the above-mentioned silica gel mixed system on the surface of the LED chip , and use a centrifugal precipitator to evenly deposit the fluorescent powder on the chip, then place it in a centrifugal vacuum degassing machine for degassing treatment, then apply the above-mentioned silica gel mixed system to the surface of the LED chip, and use a centrifugal precipitator to remove the fluorescent powder. The powder is evenly deposited on the chip, and then the above-men...
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