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Method for making lead frames for integrated circuit packages

A technology of lead frame and forming lead, which is applied in the direction of circuit, semiconductor/solid-state device manufacturing, electrical components, etc., and can solve the problems of long delivery time and waste of conductive layer manufacturing process

Active Publication Date: 2019-10-25
TEXAS INSTR INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, the portion of the conductive layer that is removed from the substrate during the etch process creates waste in the manufacturing process
Manufacturer lead times for producing new leadframe configurations by etching or other processes can also be long

Method used

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  • Method for making lead frames for integrated circuit packages
  • Method for making lead frames for integrated circuit packages
  • Method for making lead frames for integrated circuit packages

Examples

Experimental program
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Embodiment Construction

[0014] Throughout the drawings, like reference numerals refer to like elements, and the various features are not necessarily drawn to scale. In this specification, the term "couples or couples" includes indirect or direct electrical or mechanical connections or combinations thereof. For example, if a first device is coupled to or with a second device, the connection may be through a direct electrical connection, or through an indirect electrical connection through one or more intervening devices and connections.

[0015] Example embodiments include methods of making leadframes that use nearly all conductor materials (incoming raw materials for leadframe conductor structures) and produce leadframes having spaced-apart conductor structures (and / or other types of structures), The spacing is less than one conductive layer thickness. This method enables the rapid generation of new leadframe configurations without redesign and can reduce the manufacturer's lead time. In one embodi...

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Abstract

Described examples include a method (100) of making a semiconductor die package. The method (100) comprises arranging (118) at least one preformed die attach pad and at least two preformed leads on alead frame carrier in a predetermined configuration to form a lead frame, attaching (120) a semiconductor die to the at least one preformed die attach pad, wire bonding (122) the semiconductor die tothe at least two preformed leads, forming (124) a molding structure including at least part of the semiconductor die and the at least two preformed leads, and removing (126) the molding structure fromthe lead frame carrier.

Description

technical field Background technique [0001] Integrated circuit devices typically include integrated circuit chips and lead frames, which are hermetically sealed within a protective enclosure. They are used in a wide variety of products such as consumer electronics, computers, automotive, telecommunication and military applications. The lead frame electrically connects the integrated circuit chip to circuitry external to the device. Leadframes are typically formed from materials that are highly conductive and thermally conductive, such as copper or copper alloys. The lead frame material is stamped or etched into a plurality of leads, and a central area called a die attach pad to which the integrated circuit die is attached. Chips are typically electrically connected to leads by wire bonds, and devices are encapsulated to provide mechanical and environmental protection. [0002] Conventional leadframes for integrated circuit packaging are typically fabricated using a metal ...

Claims

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Application Information

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IPC IPC(8): H01L23/495H01L21/70
CPCH01L2224/48091H01L2224/97H01L2224/83005H01L2224/16245H01L2224/48247H01L2224/83192H01L2224/92247H01L2924/19105H01L2224/85005H01L23/3107H01L23/3142H01L21/568H01L23/49548H01L21/4821H01L21/4842H01L21/561H01L2924/00014H01L2224/83H01L2224/85H01L2224/81H01L21/565H01L21/4875H01L21/78H01L23/49503H01L23/498
Inventor Y·C·霍
Owner TEXAS INSTR INC
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