Cooling fan and cooling device for electronic equipment and electronic equipment

Abstract

The invention discloses a cooling fan for electronic equipment, a cooling device and the electronic equipment. The cooling fan comprises a fan base body, a fan cover body and a fan impeller. Wherein an air outlet is formed between the fan seat body and the fan cover body, the fan cover body comprises a cover body part and an extending part connected to one end, close to the air outlet, of the cover body part, and the extending part is configured to be arranged between a heat pipe and a bottom shell of the electronic equipment. The heat dissipation device comprises a heat pipe, a heat dissipation fin and a heat dissipation fan, the heat dissipation fin is arranged on the side, opposite to a bottom shell of the electronic equipment, of the heat pipe, an air outlet of the heat dissipation fanis opposite to the heat dissipation fin, and the extending part is arranged between the heat pipe and the bottom shell. The electronic equipment comprises a bottom shell, a top shell and a heat dissipation device arranged between the bottom shell and the top shell, and the extending part is located between the heat pipe and the bottom shell. According to the invention, the heat pipe can be protected from being deformed or damaged easily when the bottom shell is impacted by external force.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic equipment, in particular to a heat dissipation fan for electronic equipment, a heat dissipation device and electronic equipment. Background technique [0002] With the development of the thin and light notebook market, the thickness direction of notebook computers is required to be thinner and lighter, and the quality is also required to be lighter and lighter, resulting in thinner and lighter casings of notebook computers. Usually, the shell material of a notebook computer is generally made of plastic 1.6mm or magnesium-aluminum alloy 0.8mm. In order to place parts in the limited space of the notebook computer, the shell needs to be partially excavated. Using CNC technology to dig out the material will damage the shell. hardness is affected. In addition, in order to pursue higher performance in thin and light notebook computers, heat dissipation modules usually use heat pi...

AI Technical Summary

Problems solved by technology

The wall thickness of the heat pipe of a notebook computer is very thin, generally only 0.20mm or 0.25mm; the outer wall of the heat pipe is made of ordinary copper, the inside of the heat pipe is copper powder and a small amount of distilled water, and the rest is vacuum, and the heat pipe can be easily bent or shear damage

Based on the above two factors, the heat pipe of the cooling module inside the notebook is easily deformed or damaged by external force, and since the heat pipe is close to the bottom case of the system, it is very easy to cause the heat pipe to be stressed and be damaged when the bottom case of the system is hit. deformed or damaged

Once the heat pipe loses its heat conduction performance, the entire heat dissipation module will almost lose its heat dissipation capability, which will be fatal to the heat dissipation capability of the entire system, and the laptop system will crash and cannot operate stably

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