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Manufacturing method for conductive film based on printing process

A manufacturing method and technology of conductive film, which can be applied to equipment for manufacturing conductive/semiconductive layer, conductive layer on insulating carrier, cable/conductor manufacturing, etc. Problems such as uneven thickness, to avoid the coffee ring effect and increase the surface wettability

Inactive Publication Date: 2019-10-29
SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the preparation technologies of most conductive films are mainly methods such as magnetron sputtering, thermal evaporation and spin coating, but the above-mentioned processing methods have the disadvantage of low material utilization, resulting in a large waste of resources, and are not suitable for large-area devices. preparation of
[0003] Although the current printing technology can overcome the above shortcomings, the ink in the printing process is prone to coffee ring phenomenon during the solvent volatilization and drying process, resulting in uneven thickness and large roughness of the functional film, which is not conducive to the preparation of high-performance optoelectronic devices.

Method used

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  • Manufacturing method for conductive film based on printing process
  • Manufacturing method for conductive film based on printing process
  • Manufacturing method for conductive film based on printing process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Figure 2A to Figure 2E A process diagram of a conductive film according to Embodiment 1 of the present invention is shown. The method for manufacturing a conductive film based on a printing process includes steps S01 to S04:

[0042] Specifically, step S01: as Figure 2A As shown, a conductive substrate 10 is provided, and the conductive substrate 10 is cleaned. As a preferred embodiment, the conductive substrate 10 includes a substrate 11, a conductive layer 12 disposed on the substrate 11, and a pixel defining layer disposed on the conductive layer 12 13. The substrate 11 is preferably a glass substrate, and the pixel defining layer 13 includes a plurality of through holes 13a arranged at intervals, and the through holes 13a and the conductive layer 12 enclose pixel pits. The material of the conductive layer 12 is preferably a transparent electrode material, such as ITO. As a preferred embodiment, the shape of the through hole 13a is elliptical, the major axis of t...

Embodiment 2

[0051] The method for manufacturing a conductive film based on a printing process according to Embodiment 2 of the present invention includes steps S11 to S14:

[0052] Step S11: providing a conductive substrate 10, and cleaning the conductive substrate 10. The structure of the conductive substrate 10 in the second embodiment includes a substrate 11, a conductive layer 12 disposed on the substrate 11, and a pixel defining layer 13 disposed on the conductive layer 12. The substrate 11 is preferably a flexible substrate, and the material of the flexible substrate is poly Ethylene terephthalate, the conductive layer 12 and the pixel defining layer 13 in this embodiment are the same as those in the first embodiment, and will not be repeated here. The method of cleaning the conductive substrate 10 in the second embodiment is the same as the method of cleaning the conductive substrate 10 in the first embodiment, and will not be repeated here.

[0053] Step S12: Print the conductive...

Embodiment 3

[0059] The method for manufacturing a conductive film based on a printing process according to Embodiment 2 of the present invention includes steps S21 to S24:

[0060] Specifically, step S21: as Figure 4A As shown, a conductive substrate 10 is provided, and the conductive substrate 10 is cleaned. As a preferred embodiment, the conductive substrate 10 includes a substrate 11 and a conductive layer 12 disposed on the substrate 11, the substrate 11 is preferably a glass substrate, and the material of the conductive layer 12 is preferably a transparent electrode material, such as ITO. The method of cleaning the conductive substrate 10 in the third embodiment is the same as the method of cleaning the conductive substrate 10 in the first embodiment, and will not be repeated here.

[0061] Step S22: if Figure 4B As shown, the conductive ink 20 is printed on the conductive substrate 10 using an inkjet printing process. Specifically, the conductive ink 20 in this embodiment inclu...

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Abstract

The invention discloses a manufacturing method for a conductive film based on a printing process. The method includes the following steps: providing a conductive substrate, and performing cleaning treatment on the conductive substrate; printing conductive ink on the conductive substrate by utilizing the printing process; performing pre-annealing treatment on the conductive ink; and performing curing drying treatment on the conductive ink subjected to the pre-annealing treatment to form the conductive film. The manufacturing method for the conductive film based on the printing process performsthe cleaning treatment on the surface of the conductive substrate to remove dust and particles and to increase surface wettability thereof, the conductive ink is uniformly spread on the conductive substrate through the printing process, the conductive ink is subjected to the pre-annealing treatment to make the conductive ink lose flowability, finally the conductive ink is subjected to drying treatment to obtain the conductive film with good uniformity, and the manufacturing method effectively avoids a coffee-ring effect.

Description

technical field [0001] The invention relates to the technical field of optoelectronic devices, in particular to a method for manufacturing a conductive film based on a printing process. Background technique [0002] Photoelectric devices, including photodetectors, solar cells, and light-emitting diodes, play an important role in people's production and life and are widely used in all aspects of society. In optoelectronic devices, the transparent conductive layer, that is, the carrier transport layer, is the basic structure. At present, the preparation technologies of most conductive films are mainly methods such as magnetron sputtering, thermal evaporation and spin coating, but the above-mentioned processing methods have the disadvantage of low material utilization, resulting in a large waste of resources, and are not suitable for large-area devices. preparation. [0003] Although the current printing technology can overcome the above shortcomings, the ink in the printing ...

Claims

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Application Information

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IPC IPC(8): H01B5/14H01B13/00
CPCH01B5/14H01B13/0026
Inventor 张东煜林通牟婉莹崔铮
Owner SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI
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