The invention discloses a chip sintered product, a sub unit, an IGBT packaging module and a preparation method. The chip sintered product comprises a first molybdenum sheet, a second molybdenum sheetand a chip placed between the first and second molybdenum sheets; at least one of the first and second molybdenum sheets is a prefabricated molybdenum sheet; the prefabricated molybdenum sheet is a molybdenum sheet with a prefabricated nanometer silver film on the surface; in addition, at least one surface of the chip is in contact with the prefabricated nanometer silver film; by adoption of the prefabricated nanometer silver film, distribution uniformity of nanometer silver particles in the subsequent pressuring and sintering process can be improved effectively, a "coffee ring effect" can beavoided, and thermal resistance can be lowered; meanwhile, it is ensured that nano-scale holes are uniformly distributed in a sintering layer obtained by sintering, and by virtue of the nano-scale holes, stress generated between the chip and the molybdenum sheet can be lowered effectively, and the shearing strength of the chip sintered product is improved; and by adoption of the chip sintered product and the IGB packaging module with low thermal resistance and high shearing strength, the sintering layer obtained by sintering the prefabricated nanometer silver film has high compactness, and thenano-scale holes are distributed.