Embedded three-dimensional structure micro heating plate, preparation method and gas sensor

A three-dimensional structure, micro-heating technology, applied in the shape of heating elements, instruments, scientific instruments, etc., can solve the problem of uneven deposition of sensing materials, and achieve the effects of convenient drip positioning, constant and uniform heat radiation, and reduced power consumption.

Pending Publication Date: 2021-10-19
CHINA PETROLEUM & CHEM CORP +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a built-in three-dimensional structure micro-heating plate and its preparation method to reduce the power consumption of the micro-heating plate and solve the problem of uneven deposition of sensing materials due to the coffee ring effect when the sensing layer is integrated by dripping method question

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  • Embedded three-dimensional structure micro heating plate, preparation method and gas sensor
  • Embedded three-dimensional structure micro heating plate, preparation method and gas sensor
  • Embedded three-dimensional structure micro heating plate, preparation method and gas sensor

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Embodiment 1

[0044] figure 1 It is a schematic structural view of the embedded three-dimensional structure micro-heating plate provided by Embodiment 1 of the present invention, figure 2 It is a top view of the concave cavity of the embedded three-dimensional structure micro-heating plate provided by Embodiment 1 of the present invention, image 3 It is a cross-sectional view of the embedded three-dimensional micro-heating plate provided by Embodiment 1 of the present invention. refer to Figure 1 to Figure 3 , a kind of built-in three-dimensional structure micro-heating board that the present embodiment provides, comprises silicon-based substrate 10 and electrode layer 30, and the surface layer of described silicon-based substrate 10 is provided with concave cavity 20, and the depth of described concave cavity 20 is 20-100μm. The electrode layer 30 includes a heating electrode 31 and a measuring electrode 32 , and the heating electrode 31 and the measuring electrode 32 are embedded in...

Embodiment 2

[0047] Figure 4 and Figure 5 It is a top view of the concave cavity of the embedded three-dimensional structure micro-heating plate provided by the second embodiment of the present invention, Figure 6 It is a cross-sectional view of the embedded three-dimensional structure micro-heating plate provided by the second embodiment of the present invention. refer to Figure 4 to Figure 6 , the concave cavity 20 is arranged on the upper surface of the silicon-based substrate 10, and the heating electrode pad 33 is arranged on the surface of the silicon-based substrate 10 adjacent to the outer edge of the concave cavity 20, and the heating electrode 31 is drawn out to the heating electrode Pad 33. The concave cavity 20 is in the shape of a truncated cone, and the heating electrodes 31 are arranged in a regular shape along the side wall or the sunken bottom of the concave cavity 20 . Such as Figure 4 As shown, the heating electrodes 31 are arranged in an "S" shape along the si...

Embodiment 3

[0052] Figure 7 It is a flow chart of the preparation method of the embedded three-dimensional structure micro-heating plate provided by the third embodiment of the present invention. refer to Figure 7 A method for preparing a built-in three-dimensional structure micro-heating plate provided in this embodiment comprises the following steps:

[0053] S1) Provide a silicon-based substrate.

[0054] The silicon-based substrate is preferably a 4-inch n-type (100) silicon wafer with a thickness of 200-550 μm.

[0055] S2) Making a concave cavity on the surface layer of the silicon-based substrate.

[0056] A window pattern is formed on the surface of the silicon-based substrate by a photolithography process, and the concave cavity is etched in the window pattern area by an ion etching process under the protection of a photoresist. Specifically, chemical vapor deposition is used to form a silicon oxide film with a thickness of 500nm on the surface of the silicon wafer, and the...

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Abstract

The invention relates to the technical field of gas sensors, and discloses an embedded three-dimensional structure micro heating plate which comprises a silicon-based substrate and an electrode layer. A cavity is formed in the surface layer of the silicon-based substrate; the electrode layer comprises a heating electrode and a measuring electrode, and the heating electrode and the measuring electrode are embedded in the cavity. According to the micro heating plate, the embedded electrode layer is adopted, the electrode layer is supported through the cavity structure, and the mechanical stability is good. As the heating electrode is embedded in the cavity, the heating space is optimized into an embedded cavity structure from a plane structure which is completely exposed in the environment, the influence of environmental airflow on the central heating area is small, heat convection is carried out in the cavity, and heat radiation on the inner wall of the cavity is constant and uniform, so that the heat loss is slow, the heat loss is low, and the power consumption of the micro heating plate can be reduced. According to the micro heating plate, the good mechanical stability is ensured under the condition that the power consumption is reduced.

Description

technical field [0001] The invention relates to the technical field of gas sensors, in particular to an embedded three-dimensional structure micro-heating plate, a preparation method of the embedded three-dimensional structure micro-heating plate and a gas sensor. Background technique [0002] Gas sensors are mainly divided into electrochemical type, semiconductor type, heat conduction type, and optical type, etc. Among them, semiconductor gas sensors are widely used because of their high detection sensitivity, short response recovery time, small component size, and long life. In recent years, with the development of micromachining technology, semiconductor gas sensors are developing towards integration and intelligence. The core of the micro gas sensor is to integrate a micro hot plate silicon base structure with heating electrodes and measuring electrodes on the substrate. The structure of the micro-hot plate is divided into two types, the closed film type and the cantile...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/00H05B3/54
CPCG01N27/00H05B3/54
Inventor 李娜安飞金艳姜慧芸徐伟姜杰
Owner CHINA PETROLEUM & CHEM CORP
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