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Display substrate and preparation method thereof and display device

A display substrate and substrate substrate technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problem of fast solvent evaporation rate, uneven film thickness of pixel ink, impact on display device life and display effect, etc. question

Active Publication Date: 2019-11-05
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The formation of the pixel film includes the process of droplet falling, spreading, and drying. During the heating and evaporation process after the droplet falls to the pixel area, the saturated vapor pressure of the pixel ink near the edge of the pixel defining layer is small, resulting in The solvent evaporation rate of the pixel ink is fast, and finally the solutes continue to accumulate at the edge of the pixel boundary layer, resulting in a coffee ring effect in which the thickness of the functional film layer in the peripheral part of the sub-pixel area is large, and the thickness of the functional film layer in the middle part is small. The film thickness of the pixel ink is uneven, which has a great impact on the life and display effect of the display device

Method used

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  • Display substrate and preparation method thereof and display device
  • Display substrate and preparation method thereof and display device
  • Display substrate and preparation method thereof and display device

Examples

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no. 1 example

[0034] figure 2 It is a cross-sectional view showing a film of pixel ink in a substrate according to an embodiment of the present invention. Such as figure 2 As shown, the display substrate in the embodiment of the present invention includes a base substrate 10, on which a pixel defining layer 11 is arranged, and a pixel region 12 for accommodating pixel ink is formed between the pixel defining layers 11, and between the pixel defining layers 11 A light-to-heat conversion layer 14 for converting light energy into heat energy is arranged on it.

[0035] Such as figure 2 As shown, in this embodiment, the substrate is dripped with pixel ink in the pixel area 12, and then the pixel ink in the pixel area 12 is heated, and at the same time, the light-to-heat conversion layer 14 on the pixel defining layer 11 is irradiated by light, The light-to-heat conversion layer 14 converts the light energy irradiated thereon into heat energy, and uses the heat energy formed by light energ...

no. 2 example

[0042] Figure 4 A schematic diagram showing the structure of core-shell nanoparticles in a substrate for an embodiment of the present invention. Such as Figure 4 As shown, this embodiment is an extension of the aforementioned first embodiment. This embodiment shows that the material of the light-to-heat conversion layer in the substrate includes core-shell nanoparticles 15, and the core-shell nanoparticles 15 include a light-to-heat conversion material core 151 and A hydrophobic material shell 152 wrapped on the outer surface of the light-to-heat conversion material core 151 .

[0043] In the embodiment, the material of the core of the light-to-heat conversion material and the material of the shell of the hydrophobic material are not limited, as long as the material of the core of the light-to-heat conversion material can convert light energy into heat energy, and the material of the shell of the hydrophobic material can form the light-to-heat conversion layer A hydrophobi...

no. 3 example

[0046] Based on the technical idea of ​​the foregoing embodiments, the embodiments of the present invention further provide a method for preparing a display substrate, so as to prepare the display substrate of the foregoing embodiments.

[0047] Figure 5 A flowchart showing a method for preparing a substrate is an embodiment of the present invention. Such as Figure 5 As shown, the embodiment of the present invention shows that the preparation method of the substrate includes:

[0048] 1) A pixel defining layer is formed on the base substrate, and a pixel area for accommodating pixel ink is formed between the pixel defining layers;

[0049] 2) forming a light-to-heat conversion layer for converting light energy into heat energy on the pixel defining layer;

[0050] 3) dripping pixel ink into the above pixel area;

[0051] 4) Heating the pixel ink in the above-mentioned pixel area, and irradiating the above-mentioned light-to-heat conversion layer with light; so that the l...

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Abstract

The embodiment of the invention provides a display substrate and a preparation method thereof and a display device. The display substrate includes an underlayment substrate on which a pixel defining layer is arranged. A pixel area for containing pixel ink is formed in the middle of the pixel defining layer. A photo-thermal conversion layer for converting light energy to heat energy is arranged onthe pixel defining layer. The thickness of a film formed by the pixel ink is uniform, and the coffee ring effect is avoided.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display substrate, a preparation method thereof, and a display device. Background technique [0002] Compared with Liquid Crystal Display (LCD), Organic Light-Emitting Diode (OLED) has the advantages of self-illumination, fast response, wide viewing angle, high brightness, bright color, light and thin, etc. next generation display technology. [0003] OLED film-forming methods mainly include evaporation process or solution process. The evaporation process is relatively mature in small-scale applications, and this technology has been applied in mass production. The solution process OLED film-forming methods mainly include inkjet printing, nozzle coating, spin coating, screen printing, etc. Among them, inkjet printing technology is considered to be a large-scale OLED technology due to its high material utilization rate and large-scale realization. An important way to achieve ...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/52H01L51/56
CPCH10K59/60H10K59/12H10K50/87H10K59/1201H10K71/00
Inventor 胡滕滕周波
Owner BOE TECH GRP CO LTD
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