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A mask assembly and a manufacturing method of a mini LED backlight module

A manufacturing method and technology for a backlight module, which are applied to spray devices and other directions, can solve the problems of lack of mass production, low spraying efficiency, and complicated procedures, and achieve the effects of mass production, high spraying efficiency, and simple procedures.

Active Publication Date: 2021-03-02
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The embodiment of the present invention provides a method for manufacturing a mask assembly and a Mini LED backlight module, which is used to solve the complicated process in the silicone coating method for forming a mouth-shaped wall around the light-emitting chip in the existing Mini LED backlight. , low spraying efficiency, lack of mass production and other insurmountable shortcomings

Method used

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  • A mask assembly and a manufacturing method of a mini LED backlight module
  • A mask assembly and a manufacturing method of a mini LED backlight module
  • A mask assembly and a manufacturing method of a mini LED backlight module

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Embodiment Construction

[0039] In order to make the object, technical solution and advantages of the present invention more clear, the specific implementation of the mask assembly and the manufacturing method of the Mini LED backlight module provided by the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the preferred embodiments described below are only used to illustrate and explain the present invention, not to limit the present invention. And in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. It should be noted that the thickness and shape of each layer of the film in the drawings do not reflect the actual scale, and the purpose is only to illustrate the content of the present invention. And the same or similar reference numerals represent the same or similar elements or elements having the same or similar functio...

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Abstract

The invention discloses a mask assembly and a manufacturing method of a Mini LED backlight module. After luminous chips are subjected to crystal fixing, the mask assembly is pasted above the luminouschips, all mask regions correspond to the luminous chips one to one, thus, second shielding parts of the mask regions cover the luminous chips, spraying parts correspond to the positions of gaps in the peripheries of the luminous chips, then materials for manufacturing reflecting structures are sprayed to the positions of the gaps of the luminous chips through hollowed-out regions of the sprayingparts to form the reflecting structures, as the materials for manufacturing the reflecting structures can be simultaneously sprayed to the peripheries of the luminous chips, the procedures are simple,the consumed time is short, the spraying efficiency is high, and mass production is achieved; and in the spraying process, the second shielding parts shield the luminous chips, the spraying materialsare prevented from being sprayed onto the luminous chips, and therefore no large welding error is caused to the following Mini LED backlight module.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for manufacturing a mask component and a Mini LED backlight module. Background technique [0002] Existing studies have found that if the white silica gel made of mixed titanium dioxide with a reflectivity as high as 95% is coated on the gap between the light-emitting chips on the Mini LED backlight substrate to form a mouth-shaped wall, such as Figure 1A and Figure 1B as shown, Figure 1A It is a schematic diagram of the top view structure of the Mini LED backlight, Figure 1B for Figure 1A The schematic diagram of the cross-sectional structure of the Mini LED backlight is shown. Forming a mouth-shaped wall 3 in the gap between the light-emitting chips 2 on the substrate 1 can greatly improve the light efficiency of the light-emitting chip 2 and thereby improve the overall brightness of the Mini LED backlight. Parameters such as the height h of the wall 3 and the d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05B12/28
CPCB05B12/28
Inventor 杨山伟马俊杰翟明卢元达岂林霞
Owner BOE TECH GRP CO LTD