Glue drying process after glue dispensing of LED device

A technology of LED devices and glue, which is applied in the direction of semiconductor devices, electrical components, pre-treated surfaces, etc., can solve the problems of variation and increase of glue characteristics, etc.

Inactive Publication Date: 2019-11-08
SUZHOU KINGLIGHT OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The temperature of the first stage of baking glue is 135°C. After the baking glue time is over for 1 hour, it needs to be manually transferred to the second stage of baking....

Method used

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Examples

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Embodiment

[0018] A glue drying process after dispensing of LED devices, comprising the following steps:

[0019] S1. Prepare to bake the oven for drying the glue after dispensing LED components, improve the oven accessories, change the oven body from the original single-stage temperature control to the existing multi-stage temperature control, and the oven body is changed from the original single-stage temperature controller AI -508 is changed to the existing multi-stage thermostat AI-516.

[0020] S2. Set the temperature and time of each section required for the drying characteristics of the glue to increase the drying time of the glue and change the baking method;

[0021] S3, putting the LED device with glue after dispensing into the oven;

[0022] S4. Baking the LED device with glue after dispensing is divided into six sections: the first section, set the temperature of the oven to 135°C, keep the glue for baking the LED device with glue after dispensing for 1 minute, and then stop...

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PUM

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Abstract

The invention discloses a glue drying process after glue dispensing of an LED device. The glue drying process comprises the following steps of 1, preparing a glue drying oven for baking the LED devicewhich is subjected to glue dispensing, improving oven accessories, and changing a drying oven body from original single-section temperature control to existing multi-section temperature control; 2, setting the temperature and the time, required by the glue drying characteristic, of each section, increasing the drying time of glue, and changing a baking operation method; 3, placing the LED devicewith the glue after glue dispensing into the drying oven; and 4, baking the LED device with the glue after glue dispensing in six sections, specifically, baking the glue at the first section of 135 DEG C for 1 minute, baking the glue at the second section of 135 DEG C for 60 minutes, baking the glue at the third section of 135 DEG C for 1 minute, baking the glue at the fourth section of 150 DEG Cfor 1 minute, baking the glue at the fifth section of 150 DEG C for 240 minutes, and baking the glue at the sixth section of 150 DEG C for 1 minute. According to the glue drying process, the stabilityof the LED glue is guaranteed, the situation of characteristic change caused by exposure to air is avoided, the labor efficiency and the curing quality of the LED glue are improved, the step of manually transferring the device to a drying oven in the next stage is omitted, and the product quality is also improved.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to a glue drying process after dispensing glue for LED devices. Background technique [0002] With the rapid development of indoor and outdoor LED display application technology, the performance of the currently used surface mount LED devices for display screens can no longer meet the increasing requirements of the market. [0003] Surface-mounted LED devices for display screens, especially outdoor LED devices, have high requirements on environmental adaptability, and need to have excellent moisture-proof performance and high and low temperature resistance. In order to achieve excellent moisture-proof performance, there are generally two different baking temperatures in the LED packaging glue process at present, so that the glue filling glue is exposed to the air during the process of switching from one temperature to another temperature, which greatly increases the difference in glue c...

Claims

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Application Information

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IPC IPC(8): B05D3/02H01L33/00
CPCB05D3/02B05D3/0209H01L33/005
Inventor 龚文罗志军岳小帅
Owner SUZHOU KINGLIGHT OPTOELECTRONICS CO LTD
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