Semiconductor wafer polishing equipment for electronic devices
A technology of electronic devices and semiconductors, which is applied in the field of semiconductor wafer polishing equipment for electronic devices, can solve the problems of polishing efficiency or precision impact, and achieve the effect of improving the ability to take away and remove polishing debris, reducing deformation, and reducing adverse effects
Active Publication Date: 2021-01-26
倍特微半导体科技(江苏)有限公司
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Problems solved by technology
[0004] However, considering the polishing efficiency and precision of the wafer, too large or too small of the cavity or pores will have adverse effects, and the different stages of polishing have different rotating speeds, which actually affect the cavity or pores in the polishing pad. The size requirements are also different, but the current equipment does not take this issue into account, resulting in different polishing stages, polishing efficiency or precision being affected
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Embodiment Construction
[0028] see Figure 1-7 , in the embodiment of the present invention, a kind of semiconductor wafer polishing equipment for electronic device, comprises workbench 4, lifting control seat 3, drive mechanism, wafer fixation mechanism 5 and polishing pad 6, wherein, described workbench is provided with pair of wafers The wafer fixing mechanism 5 that drives and rotates and fixes the wafer, the lift control seat 3 is also installed on the workbench, and the lift control seat 3 is supported with the drive mechanism. The end portion is connected with the polishing pad 6; the polishing pad 6 includes a support layer 61, an elastic layer 62 and a polishing layer 64 connected in sequence from top to bottom, and the polishing layer is provided with a plurality of slurry for the abrasive slurry to enter. The hole 65 is characterized in that it also includes a magnetostrictive composite layer, and the magnetostrictive composite layer is arranged between the elastic layer and the polishing ...
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Abstract
The invention discloses semiconductor wafer polishing equipment for electronic devices, and relates to the technical field of semiconductor wafer processing. According to the equipment, a magnetostrictive composite layer is arranged, the magnetostrictive composite layer is arranged between an elastic layer and a polishing layer or in the polishing layer, an electromagnetic control mechanism is used for controlling telescopic deformation of the magnetostrictive composite layer, in this way, the grinding efficiency and precision of a polishing pad can be effectively controlled, deformation of the magnetostriction composite layer can be increased along with the increase of the relative rotation speed between the polishing pad and a wafer, the thick liquid passing capacity of a thick liquid hole can be improved through deformation of the magnetostrictive composite layer, the cooling effect of the polishing pad is improved, the capability of taking away and removing polishing debris can beimproved, the polishing quality of the wafer is guaranteed, when the rotation speed is reduced, deformation can be reduced, so that the polishing efficiency is higher, the porosity is smaller, the smoothness of the surface of the wafer is improved, and the adverse effects of polishing the wafer caused by overlarge aperture are reduced.
Description
technical field [0001] The invention relates to the technical field of semiconductor wafer processing, in particular to semiconductor wafer polishing equipment for electronic devices. Background technique [0002] For wafer polishing, chemical mechanical polishing (CMP) is the most popular polishing method at present. Chemical mechanical polishing (CMP) is a polishing method that combines chemical force and mechanical force to smooth the surface. It uses a chemical polishing slurry with grinding and etching effects, and is used together with a polishing pad. Chemical mechanical polishing can effectively remove the material on the wafer, and it is easy to make the irregular undulations of the wafer flat and stable. In turn, the surface quality of the wafer can reach a higher level. [0003] At present, when polishing a wafer, due to the high rotational speed between the polishing pad and the wafer, the friction between them generates more heat. The debris is carried away, a...
Claims
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IPC IPC(8): B24B37/00B24B37/11B24B37/005B24B37/34B24B55/02
CPCB24B37/00B24B37/005B24B37/11B24B37/34B24B55/02
Inventor 韩红培
Owner 倍特微半导体科技(江苏)有限公司