Ultrasonic nanometer cooling device for computer mainboard

Abstract

The invention discloses an ultrasonic nanometer cooling device for a computer mainboard. The device comprises a bearing plate, an air inlet fan, an exhaust fan, an ultrasonic conduction device and a CPU cooling device, a left ventilation hood and a right ventilation hood are arranged on one side wall of the bearing plate, fixing plates are welded to the inner side wall of the left ventilation hoodand the inner side wall of the right ventilation hood, the air inlet fan is installed in the left ventilation hood through the fixing plates, and the exhaust fan is installed in the right ventilationhood through the fixing plates. An aluminum alloy sliding sleeve sealing cover on a nanometer heat conductor on one side of an aluminum alloy heat dissipation plate is attached to the back face of aCPU; heat generated by the CPU is transferred to the metal nanoparticles in the metal nano box through the aluminum alloy sliding sleeve sealing cover; due to the fact that the ultra-thin vibration piece on the aluminum alloy sliding sleeve sealing cover receives sound waves emitted by the ultrasonic vibrator to generate the resonance phenomenon, the ultra-thin vibration piece can enable the metalnanoparticles to vibrate, the heat exchange surface between the metal nanoparticles is enlarged, and then the heat is completely transmitted to the aluminum alloy heat dissipation plate and dissipated.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic equipment, in particular to an ultrasonic nano-cooling device for a computer motherboard. Background technique [0002] The computer is basically a kind of machine that is always available in life, office and automation control, but the key factors that affect the normal operation of the computer are heat dissipation and dust prevention. At present, the heat dissipation of the computer mainly has the following problems: 1. Usually, fans are used to cooperate with aluminum alloy to dissipate heat. The radiator is attached to the CPU for single heat dissipation, but the main board also generates extra heat due to the slow oxidation reaction, which increases the calorific value; 3. The aluminum alloy radiator usually adopts a thin-walled mesh structure. When it is in a place with dust pollution, Chen Za will 3. At present, when dealing with the heat dissipation of the CPU, an a...

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Problems solved by technology

[0002] The computer is basically a kind of machine that is always available in life, office and automation control, but the key factors that affect the normal operation of the computer are heat dissipation and dust prevention. At present, the heat dissipation of the computer mainly has the following problems: 1. Usually, fans are used to cooperate with aluminum alloy to dissipate heat. The radiator is attached to the CPU for single heat dissipation, but the main board also generates extra heat due to the slow oxidation reaction, which increases the calorific value; 3. The aluminum alloy radiator usually adopts a thin-walled mesh structure. When it is in a place with dust pollution, Chen Za will 3. At present, when dealing with the heat dissipation of the CPU, an aluminum alloy radiator is usually used to contact the CPU, and heat-conducting silicone grease is applied between the two. Although the heat conduction effect is good, it is easy to use for a period of time. Hardening, which in turn affects heat dissipation, so the present invention provides a computer motherboard ultrasonic nano-cooling device

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