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Ultrasonic nano cooling device for computer motherboard

A cooling device, ultrasonic technology, applied in the direction of electrical digital data processing, instruments, calculations, etc., can solve the problems of increasing calorific value, affecting heat dissipation, easy hardening, etc., and achieve the effect of increasing the heat exchange surface

Inactive Publication Date: 2020-09-29
ZHEJIANG GUANGSHA COLLEGE OF APPLIED CONSTRTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The computer is basically a kind of machine that is always available in life, office and automation control, but the key factors that affect the normal operation of the computer are heat dissipation and dust prevention. At present, the heat dissipation of the computer mainly has the following problems: 1. Usually, fans are used to cooperate with aluminum alloy to dissipate heat. The radiator is attached to the CPU for single heat dissipation, but the main board also generates extra heat due to the slow oxidation reaction, which increases the calorific value; 3. The aluminum alloy radiator usually adopts a thin-walled mesh structure. When it is in a place with dust pollution, Chen Za will 3. At present, when dealing with the heat dissipation of the CPU, an aluminum alloy radiator is usually used to contact the CPU, and heat-conducting silicone grease is applied between the two. Although the heat conduction effect is good, it is easy to use for a period of time. Hardening, which in turn affects heat dissipation, so the present invention provides a computer motherboard ultrasonic nano-cooling device

Method used

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  • Ultrasonic nano cooling device for computer motherboard
  • Ultrasonic nano cooling device for computer motherboard
  • Ultrasonic nano cooling device for computer motherboard

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Embodiment approach

[0025] As a preferred embodiment of the present invention, magnetic pillars are uniformly arranged on one side wall of the bearing plate 1 .

[0026] As a preferred embodiment of the present invention, the ultrasonic transmitter 9 is provided with an ultrasonic frequency modulation device.

[0027] As a preferred embodiment of the present invention, a side wall of the aluminum alloy cooling plate 12 is uniformly provided with mounting holes, and bolts are sleeved in the mounting holes.

[0028] As a preferred embodiment of the present invention, the ultrasonic vibrator 11 corresponds to the aluminum alloy cooling plate 12 .

[0029] As a preferred embodiment of the present invention, both the inlet fan 2 and the exhaust fan 3 are provided with a motor and fan blades, and the fan blades are arranged at one end of the motor.

[0030] As a preferred embodiment of the present invention, the control buttons include a start button and a stop button, and the control buttons are conn...

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Abstract

The invention discloses an ultrasonic nanometer cooling device for a computer mainboard. The device comprises a bearing plate, an air inlet fan, an exhaust fan, an ultrasonic conduction device and a CPU cooling device, a left ventilation hood and a right ventilation hood are arranged on one side wall of the bearing plate, fixing plates are welded to the inner side wall of the left ventilation hoodand the inner side wall of the right ventilation hood, the air inlet fan is installed in the left ventilation hood through the fixing plates, and the exhaust fan is installed in the right ventilationhood through the fixing plates. An aluminum alloy sliding sleeve sealing cover on a nanometer heat conductor on one side of an aluminum alloy heat dissipation plate is attached to the back face of aCPU; heat generated by the CPU is transferred to the metal nanoparticles in the metal nano box through the aluminum alloy sliding sleeve sealing cover; due to the fact that the ultra-thin vibration piece on the aluminum alloy sliding sleeve sealing cover receives sound waves emitted by the ultrasonic vibrator to generate the resonance phenomenon, the ultra-thin vibration piece can enable the metalnanoparticles to vibrate, the heat exchange surface between the metal nanoparticles is enlarged, and then the heat is completely transmitted to the aluminum alloy heat dissipation plate and dissipated.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic equipment, in particular to an ultrasonic nano-cooling device for a computer motherboard. Background technique [0002] The computer is basically a kind of machine that is always available in life, office and automation control, but the key factors that affect the normal operation of the computer are heat dissipation and dust prevention. At present, the heat dissipation of the computer mainly has the following problems: 1. Usually, fans are used to cooperate with aluminum alloy to dissipate heat. The radiator is attached to the CPU for single heat dissipation, but the main board also generates extra heat due to the slow oxidation reaction, which increases the calorific value; 3. The aluminum alloy radiator usually adopts a thin-walled mesh structure. When it is in a place with dust pollution, Chen Za will 3. At present, when dealing with the heat dissipation of the CPU, an a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 姚炜李阳
Owner ZHEJIANG GUANGSHA COLLEGE OF APPLIED CONSTRTECH
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