Etching equipment for semiconductor monolithic integrated circuits

Abstract

The invention discloses an etching device for a semiconductor monolithic integrated circuit, which comprises a mounting seat, an up and down feeding assembly, a longitudinal sliding assembly, a knife seat, a lateral sliding assembly, a protective cover and an etching assembly. One side of the mounting seat is provided with a An up and down feed assembly, one side of the up and down feed assembly is provided with a longitudinal slide assembly, one side of the up and down feed assembly is also provided with a knife seat, and one side of the longitudinal slide assembly is connected with a lateral slide Assemblies, the bottom of the lateral sliding assembly is provided with an etching assembly, a protective cover is installed on one side of the lateral sliding assembly, the lateral sliding assembly includes a base plate, and a third guide rail is installed on one side of the base plate , one side of the third guide rail is slidably connected with a third lead screw sliding pair, the top of the third lead screw sliding pair is also installed with a second telescopic cylinder, the output rod of the second telescopic cylinder is connected to the base plate connected, the present invention has the characteristics of high processing efficiency and multiple functions.

Description

technical field [0001] The invention relates to the technical field of semiconductor chip processing, in particular to etching equipment for semiconductor monolithic integrated circuits. Background technique [0002] Etching is a technology that removes materials by chemical reaction or physical impact. Etching technology can be divided into wet etching and dry etching. Wet etching refers to the method of using the corrosion of chemicals such as nitric acid to make printing plates such as copper plates and zinc plates, and also refers to calligraphy and painting printed with such printing plates. [0003] However, when the existing semiconductor integrated circuit is etched, different etching tools are required for different chip processing area shapes, and the conventional production process needs to design a whole production line to complete it step by step. It takes a long time in the process of product delivery, and the production line occupies a large area, which incre...

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Problems solved by technology

[0003] However, when the existing semiconductor integrated circuits are etched, different etching tools are required for different chip processing area shapes, and the conventional production process needs to design a whole production line to complete it step by step.

It takes a long time in the process of product delivery, and the production line occupies a large area, which increases the cost of the factory, and the existing etching tool can only perform dry etching or wet etching alone, and two machines are required to complete the combination of dry and wet

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