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Trench gate type IGBT (insulated gate bipolar transistor) chip and mounting and use method thereof

A trench gate and chip technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of heat not being dissipated in time, affecting the working performance of the chip, and poor heat dissipation capacity of the chip, and achieving stable and accurate connection. , not easy to change, not easy to shake the effect

Pending Publication Date: 2019-11-19
富芯微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a trench gate type IGBT chip and its installation and use method, which can solve the problem that the existing chip has poor heat dissipation ability during use, and the heat generated during work cannot be dissipated in time, which affects the work of the chip. Performance, working in a high temperature environment for a long time, it is easy to cause the service life of the chip to be short, and it is easy to be damaged during use

Method used

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  • Trench gate type IGBT (insulated gate bipolar transistor) chip and mounting and use method thereof
  • Trench gate type IGBT (insulated gate bipolar transistor) chip and mounting and use method thereof
  • Trench gate type IGBT (insulated gate bipolar transistor) chip and mounting and use method thereof

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Embodiment Construction

[0043] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0044] see Figure 1-11 As shown, a trench gate type IGBT chip includes a chip base 1, a top plate 6 and a base plate 2, and the upper and lower parts of the chip base 1 are horizontally connected to the top plate 6 and the base plate 2 respectively;

[0045] The bottom corners of the top plate 6 are connected with connecting posts 8, and several jacks 9 are arranged inside and around the chip substrate 1, and the connecting posts 8 are plugged with the surroundings of the chip substrate 1 through the jacks 9, and the botto...

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Abstract

The invention discloses a trench gate type IGBT (insulated gate bipolar transistor) chip. The trench gate type IGBT (insulated gate bipolar transistor) chip comprises a chip base body, a top plate anda base plate; the upper portion and lower portion of the chip base body are respectively and horizontally connected with the top plate and the base plate; the corners of the bottom of the top plate are respectively connected with connecting columns; a plurality of insertion holes are formed in the inner portion and periphery of the chip base body; the connecting columns are inserted into the periphery of the chip base body through the insertion holes; a plurality of cooling rods are connected to the bottom of the top plate; and the bottoms of the cooling rods are inserted into the insertion holes. After the chip base body is impacted or falls on the ground during transportation, first springs, second springs, third springs and fourth springs enable a damping and buffering effect evenly, so that the chip base body is protected; after balls on the tops of fixing rods contact with the ground, the balls can roll on the ground, and therefore, a friction force is reduced; an impact force and a friction force borne by the chip base body are reduced; the chip base body does not directly contact with the ground, the worker can conveniently take and place chips, and damage caused in the taking and placing process of the chips is avoided.

Description

technical field [0001] The invention relates to a chip, in particular to a trench gate type IGBT chip and a method for installing and using the same, and belongs to the field of chip manufacturing applications. Background technique [0002] Chip, also known as microcircuit, microchip, integrated circuit. Refers to silicon chips containing integrated circuits, which are small in size and are often part of computers or other electronic equipment. In electronics, a chip is a way to miniaturize circuits, mainly including semiconductor devices, as well as passive components, and is usually manufactured on the surface of a semiconductor wafer. [0003] Most of the existing chips are a sheet with several circuits inside. The heat dissipation ability of the chip is not good during use, and the heat generated during work cannot be dissipated in time, which affects the working performance of the chip. Working in a high temperature environment for a long time will easily lead to a sh...

Claims

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Application Information

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IPC IPC(8): H01L23/04H01L23/13H01L23/367
CPCH01L23/367H01L23/04H01L23/13
Inventor 王全杨其峰邹有彪倪侠徐玉豹沈春福王超
Owner 富芯微电子有限公司
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