Trench gate type IGBT (insulated gate bipolar transistor) chip and mounting and use method thereof

Abstract

The invention discloses a trench gate type IGBT (insulated gate bipolar transistor) chip. The trench gate type IGBT (insulated gate bipolar transistor) chip comprises a chip base body, a top plate anda base plate; the upper portion and lower portion of the chip base body are respectively and horizontally connected with the top plate and the base plate; the corners of the bottom of the top plate are respectively connected with connecting columns; a plurality of insertion holes are formed in the inner portion and periphery of the chip base body; the connecting columns are inserted into the periphery of the chip base body through the insertion holes; a plurality of cooling rods are connected to the bottom of the top plate; and the bottoms of the cooling rods are inserted into the insertion holes. After the chip base body is impacted or falls on the ground during transportation, first springs, second springs, third springs and fourth springs enable a damping and buffering effect evenly, so that the chip base body is protected; after balls on the tops of fixing rods contact with the ground, the balls can roll on the ground, and therefore, a friction force is reduced; an impact force and a friction force borne by the chip base body are reduced; the chip base body does not directly contact with the ground, the worker can conveniently take and place chips, and damage caused in the taking and placing process of the chips is avoided.

Description

technical field

[0001] The invention relates to a chip, in particular to a trench gate type IGBT chip and a method for installing and using the same, and belongs to the field of chip manufacturing applications. Background technique

[0002] Chip, also known as microcircuit, microchip, integrated circuit. Refers to silicon chips containing integrated circuits, which are small in size and are often part of computers or other electronic equipment. In electronics, a chip is a way to miniaturize circuits, mainly including semiconductor devices, as well as passive components, and is usually manufactured on the surface of a semiconductor wafer.

[0003] Most of the existing chips are a sheet with several circuits inside. The heat dissipation ability of the chip is not good during use, and the heat generated during work cannot be dissipated in time, which affects the working performance of the chip. Working in a high temperature environment for a long time will easily lead to a sh...

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