Heat sinks and cooling systems

Abstract

The invention discloses a heat absorption device. The device includes a hermetic heat transfer body, microchannel modules and foam metal modules; the hermetic heat transfer body is provided with a groove body; the two ends of the extension direction of the groove body are respectively provided with openings communicating with the external of the hermetic heat transfer body; the groove body is usedfor circulating a heat transfer medium; the microchannel modules and the foam metal modules are arranged in the groove body; the microchannel modules are provided with multiple through holes; the through holes extend in the extension direction of the groove body; the foam metal modules are provided with multiple foam holes; and at least partial multiple foam holes in the multiple foam holes are in mutual communication. A heat dissipation system is also disclosed.

Description

technical field [0001] The invention relates to the technical field of thermal control, in particular to a heat absorbing device and a heat dissipation system. Background technique [0002] As the core of processors, electronic chips play an important role in high-performance computers, radars, high-power laser transmitters and other devices. In the field of precision instruments, such as aerospace, new spacecraft continue to develop in the direction of miniaturization, integration and modularization, and the power density of various spaceborne devices continues to increase. important issues that need to be addressed urgently. [0003] Conventional air-cooled radiators have limited cooling capacity (less than 80W / cm 2 ), has been unable to meet the heat dissipation requirements of higher heat flux density electronic components and equipment, and the commonly used heat pipe heat dissipation technology is also limited in the fields of deep space exploration, space-borne high...

AI Technical Summary

Problems solved by technology

[0003] Conventional air-cooled radiators have limited cooling capacity (less than 80W / cm 2 ), has been unable to meet the heat dissipation requirements of electronic components and devices with higher heat flux density, and the current commonly used heat pipe heat dissipation technology is also subject to certain restrictions in the fields of deep space exploration, space-borne high-energy microwaves, space-borne lasers, etc.

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