A kind of preparation method of modified silicon phenolic resin adhesive

Abstract

A preparation method of a modified silicon phenolic resin adhesive, characterized in that: the method comprises the following steps: first adding a phenolic hydroxyl blocking agent, a siloxane monomer, a phenolic compound and an acidic catalyst into a reaction kettle, Stir evenly, slowly heat up, and react at 110~200°C to form intermediates containing blocker groups or silicon atoms; then slowly cool down, add a certain amount of aldehyde compounds, and pass through the intermediate containing blocker groups or silicon atoms The body is further reacted at a temperature of 70~95°C to prepare a modified silicon phenolic resin adhesive based on blocking phenolic hydroxyl groups; among them: four raw materials: phenolic hydroxyl blocking agent, siloxane monomer, phenolic compound and acidic catalyst The mass ratio of the compound is 0.05~0.80:0.1~1.0:1:0.05%~4%; the molar ratio of aldehyde compounds and phenolic compounds is 0.5~1.0:1.

Description

technical field

[0001] The invention relates to the technical field of adhesive preparation, in particular to a preparation method of a modified silicon phenolic resin adhesive. Background technique

[0002] Phenolic resin (PF) is the earliest synthetic resin. Its raw materials are cheap, the synthesis process is simple, and it has excellent mechanical properties, dimensional stability, flame retardancy and electrical insulation. It is widely used in chemical industry, construction, machinery, aerospace , Bonding and other fields have been widely used. However, the heat resistance of traditional phenolic resins is affected due to the easy oxidation of phenolic hydroxyl groups and methylene groups in the molecular structure, which limits its application in certain fields, especially high-temperature fields.

[0003] In order to improve the thermal stability of the phenolic resin, silicon atoms were introduced into the macromolecular structure of the phenolic resin to partial...

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