A kind of thin film encapsulation structure and preparation method

Abstract

The embodiments of the present invention relate to the technical field of semiconductor manufacturing, and in particular to a thin-film packaging structure and a preparation method, which are used to improve the bending resistance of the inorganic layer without reducing the water-oxygen barrier capability of the OLED. The thin film encapsulation structure is arranged on the surface of the device to be encapsulated, including organic layers and inorganic layers alternately stacked; the inorganic layer includes at least two regions with different thicknesses, and the regions with at least two different thicknesses are arranged in a predetermined order on the horizontal plane regular pattern. In this way, when the inorganic layer including regions with at least two different thicknesses is bent, it can avoid stress concentration in the region with larger thickness during bending. Therefore, compared with the inorganic layer with uniform thickness in the prior art, the thin-film encapsulation structure in the embodiment of the present invention can avoid stress concentration in the bending area of ​​the inorganic layer, and thus can achieve Improve the bending resistance of the inorganic layer.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of semiconductor manufacturing, and in particular to a thin film packaging structure and a manufacturing method. Background technique [0002] At present, organic light emitting diode (Organic Light Emitting Diode, referred to as OLED) flexible display is composed of polyimide substrate, Array, OLED device, thin film encapsulation layer, TP, etc., among which the luminescent material and function in OLED device The material is sensitive to water and oxygen, so an encapsulation layer that blocks water and oxygen is needed to protect the OLED device. [0003] The thin film encapsulation layer in the prior art is a laminated structure in the form of alternating inorganic materials and organic materials, and the inorganic layers are planar structures with uniform thickness. Although the ability to block water and oxygen is high, when reaching a certain thickness Because of its rigid struct...

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Problems solved by technology

[0003] The thin film encapsulation layer in the prior art is a laminated structure in the form of alternating inorganic materials and organic materials, and the inorganic layers are planar structures with uniform thickness. Although the ability to block water and oxygen is high, when reaching a certain thickness Because of its rigid structure, it is easy to break under bending conditions, and water and oxygen intrusion can cause OLED devices to fail

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