Flexible circuit board hot-pressing device

Abstract

The invention discloses a flexible circuit board hot-pressing device. The hot-pressing device structurally comprises a connecting panel, a mounting opening, a hot pressing head, a first placing plate,a rotating chassis, a second placing plate and a heat dissipation disc; the rotating chassis is provided with a first placing plate and a second placing plate; the first placing plate and the secondplacing plate are structurally distributed in a centrosymmetric manner relative to the center of the rotating chassis; the hot pressing head is arranged right above the rotating chassis; one end of the hot pressing head is mounted on the connecting panel; a mounting opening is formed in the side end, adjacent to the hot pressing head, of the connecting panel; the heat dissipation disc is arrangedin the mounting opening. According to the invention, the channels and the zonal channels act together to diffuse gas outwards, so the circulation area of the gas outlets is increased, the heat dissipation range is wider, the heat dissipation effect is improved accordingly, the nozzles can be evenly distributed at equal intervals to blow out gas in a centralized mode, the temperature of the hot pressing head is reduced instantly, and glue overflowing in the hot-pressing process or cooling after hot-pressing is finished is avoided.

Description

technical field [0001] The invention relates to the field of flexible circuit boards, in particular to a flexible circuit board hot-pressing equipment. Background technique [0002] There are many steps and details in the production and manufacture of flexible circuit boards. Hot pressing is one of the steps. The purpose is to make the protective film or laying board completely bonded to the wrench, mainly through temperature, pressure, pressing time, The lamination and combination of auxiliary materials are controlled to achieve good adhesion. Generally, hot pressing equipment uses current to pass through the copper pool to heat the copper pool in the thermal pressing head, but the extremely strong current makes the thermal pressing head After rapid heating up, only using the cooling fins will not allow the thermal head to cool down quickly, the temperature rises instantly, and it is not easy to cool down, and it is easy to cause glue overflow due to high temperature. Con...

AI Technical Summary

Problems solved by technology

[0002] There are many steps and details in the production and manufacture of flexible circuit boards. Hot pressing is one of the steps. The purpose is to make the protective film or laying board completely bonded to the wrench, mainly through temperature, pressure, pressing time, The lamination and combination of auxiliary materials are controlled to achieve good adhesion. Generally, hot pressing equipment uses current to pass through the copper pool to heat the copper pool in the thermal pressing head, but the extremely strong current makes the thermal pressing head After the rapid heating up, only the heat sink is used to cool down the thermal head quickly. The temperature rises instantly, and it is not easy to cool down. It is easy to cause glue overflow due to high temperature.

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