Mounting equipment for multi-size chips

A multi-size, chip technology, applied in electrical components, electrical components, circuits, etc., can solve problems such as low work efficiency, inability to adapt to complex situations, and inability to mount chips of different sizes at the same time, so as to improve work efficiency and apply Wide range and effect of installation

Active Publication Date: 2021-08-03
道晟半导体(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing placement equipment for multi-size chips on the market cannot mount chips of different sizes at the same time, and the work efficiency is low, and it cannot adapt to complex situations; therefore, it does not meet the existing needs, and we have proposed Mounting equipment for multi-size chips

Method used

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  • Mounting equipment for multi-size chips
  • Mounting equipment for multi-size chips
  • Mounting equipment for multi-size chips

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Embodiment 1: A mounting device for multi-size chips, comprising a support base 1, a support cross bar 5, a U-shaped fixed rod 7 and a mounting suction nozzle 39, the support base 1 is provided with two fixing seats 3, Two supporting bars 5 perpendicular to the direction of the fixing seat 3 are installed on the fixing seat 3, a first screw 14 is arranged on one side of the supporting bar 5, and one end of the first screw 14 is connected with The first motor 10, the first screw mandrel 14 is sleeved with a first screw mandrel cover 141 that can move relative to the first screw mandrel 14, and each first screw mandrel cover 141 is connected with a first slider 12. The first slider 12 is slidably connected to the first slide rail 6 above the support cross bar 5, and each first slide rail 6 is provided with a first slider 12;

[0036] A U-shaped fixed rod 7 is slidably connected above the first slide rail 6, and the U-shaped fixed rod 7 is connected to the first slider 12 ...

Embodiment 2

[0043] Embodiment 2: A mounting device for multi-size chips, comprising a support base 1, a support cross bar 5, a U-shaped fixing bar 7 and a mounting suction nozzle 39, the support base 1 is provided with two fixing seats 3, Two supporting bars 5 perpendicular to the direction of the fixing seat 3 are installed on the fixing seat 3, a first screw 14 is arranged on one side of the supporting bar 5, and one end of the first screw 14 is connected with The first motor 10, the first screw mandrel 14 is sleeved with two first screw mandrel sleeves 141 that can move relative to the first screw mandrel 14, and each first screw mandrel sleeve 141 is connected with a first slide Block 12, the first slide block 12 is slidably connected on the first slide rail 6 above the support cross bar 5, and each first slide rail 6 is provided with two first slide blocks 12;

[0044] Two U-shaped fixed rods 7 are slidably connected above the first slide rail 6, and the U-shaped fixed rods 7 are con...

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PUM

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Abstract

The present invention is a mounting device for multi-size chips, comprising a supporting base plate, a supporting cross bar, a U-shaped fixing bar and a mounting suction nozzle, two fixing seats are arranged on the supporting base plate, and two A support bar perpendicular to the direction of the fixing seat, a first screw rod is provided on one side of the support bar, and a first motor is connected to one end of the first screw rod, and the first screw rod is sleeved with At least one first screw sleeve movable relative to the first screw rod, each first screw sleeve is connected with a first slider, and the first slider is slidably connected to the first slider above the support cross bar On the rails, at least one first slider is provided on each first slide rail. The present invention can realize the position transformation of the mounting suction nozzle front and rear, left and right, and up and down, and can also realize the multi-angle rotation of the mounting suction nozzle in the circumferential direction, and can accurately locate the position of the chip according to the chips of different sizes, so that the mounting The suction nozzle picks up the chip accurately and places the chip in the designated position.

Description

technical field [0001] The invention relates to a mounting device, in particular to a mounting device for multi-size chips. Background technique [0002] Chip mounter: Also known as "mounter" and "Surface Mount System", in the production line, it is configured after the dispenser or screen printing machine, and the surface mount system is mounted on the surface by moving the mounter head. A device that places components accurately on PCB pads. There is no need to drill holes for the printed board, and the assembly technology that directly sticks and welds the surface mount components to the specified position on the surface of the printed board can be divided into two types: manual and automatic. High assembly density, small size and light weight of electronic products. The volume and weight of SMT components are only about 1 / 10 of traditional plug-in components. Generally, after SMT is used, the volume of electronic products is reduced by 40%~60%, and the weight is reduced...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
CPCH01L21/67144H01L21/6838H01L21/68H01L21/67742
Inventor 黄力蒋丽军
Owner 道晟半导体(苏州)有限公司
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