Automatic power test machine for ultra-thin heat pipe and working method thereof

Abstract

The invention discloses an automatic power test machine for an ultra-thin heat pipe and a working method thereof. The automatic power test machine comprise a rack, a material lifting mechanism, a material height detection mechanism, a feeding mechanism, a test fixture mechanism, a program-controlled direct-current power supply and a PLC (programmable logic controller); the material height detection mechanism is provided with a trough, a material sensor and a photoelectric sensor, the material sensor is used for sensing whether materials exist in the trough, the photoelectric sensor is used fordetecting the height of the heat pipe in the trough, and the material lifting mechanism is used for maintaining the heat pipe in the trough at an appointed height; the feeding mechanism is arranged on a substrate, the feeding mechanism is provided with a vacuum sucker, and the feeding mechanism is used for realizing feeding and blanking of the heat pipe through the vacuum sucker; the test fixturemechanism is provided with a heat pipe placing block and a temperature sensing block, the heat pipe placing block is provided with a heating block and a cooling block, the feeding mechanism is used for placing the heat pipe on the heat pipe placing block through the vacuum sucker, one end of the heat pipe is in contact with the heating block, the other end of the heat pipe is in contact with thecooling block, the temperature sensing block is electrically connected with a temperature acquisition card, and the temperature sensing block is used for acquiring temperatures at two ends of the heatpipe.

Description

technical field [0001] The invention relates to the technical field of heat pipe testing, in particular to an ultra-thin heat pipe automatic power testing machine and a working method thereof. Background technique [0002] Heat pipe is a kind of high-efficiency heat conduction element based on the principle of vapor-liquid phase transition, which is widely used in the field of heat dissipation of electronic products. With the continuous improvement of the chip integration of mobile phones and other electronic products, the power consumption of chips will inevitably increase. Therefore, the use of heat pipes for thermal management of mobile phones and other electronic products has become an effective solution. However, the internal space of electronic products such as mobile phones and tablets is very limited, so it is necessary to use ultra-thin heat pipes after flattening as heat transfer elements. There are three main criteria for judging the performance of a heat pipe: h...

AI Technical Summary

Problems solved by technology

The current heat pipe test mainly uses manual clamping and manual testing, which is difficult to simulate the gravity environment of the heat pipe at different angles, the labor cost is high, the efficiency is low, and the manual loading and unloading process is very easy to cause mechanical damage to the ultra-thin heat pipe.

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