Apparatus and Methods for Temperature-Based Memory Management

Abstract

The present disclosure describes apparatuses and methods for temperature-based memory management. In some aspects, a temperature-based memory manager receives, from a temperature sensor of a memory block, an indication of a temperature of the memory block. The temperature-based memory manager compares the indication of the temperature with a temperature threshold associated with the memory block.Based on a result of the comparison, the temperature-based memory manager alters a frequency of a clock signal by which the memory block operates effective to change power consumption of the memory block. By so doing, power consumption of the memory block may be reduced, and operating temperatures of the memory block can be kept below temperatures that are likely to affect reliability of storage cells of the memory block. This can be effective to improve reliability and long-term performance of the memory block, particularly in high-performance or mission critical applications.

Description

[0001] Cross References to Related Applications [0002] This disclosure claims priority to U.S. Provisional Patent Application Serial No. 62 / 677,465, filed May 29, 2018, the disclosure of which is incorporated herein by reference in its entirety. technical field [0003] Embodiments of the present disclosure relate to memory management, and more particularly, to apparatus and methods for temperature-based memory management. Background technique [0004] To accommodate users' growing expectations for higher computing performance, many memory manufacturers have implemented advanced chips featuring high-density, high-performance memory. These high-density memory chips, typically created using process technology nodes below 65 nanometers, can experience reliability issues after prolonged use. For example, some users may start to experience memory block read / write errors or failures after years of accessing memory blocks with their devices. This poses a risk to chipmakers bec...

AI Technical Summary

Problems solved by technology

However, these interim solutions fail to address the root cause of reliability issues and involve trade-offs of additional silicon area, increased data access, or reduced data throughput

As such, most memory chips suffer negatively from the design and performance tradeoffs associated with redundancy repair, while remaining susceptible to long-term reliability issues related to memory block errors or failures

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