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Overmolded lead frame assembly for pressure sensing applications

一种引线框架、成型引线的技术，应用在测量流体压力、多个阀之间的压力差测量、测量力等方向，能够解决没有保护性特征、限制产品使用等问题

Active Publication Date: 2019-12-10
SENSATA ELECTRONIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Leadframes are directly exposed to such media without additional protective features or different processes, which may limit the use of the product depending on the application environment

Method used

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  • Overmolded lead frame assembly for pressure sensing applications
  • Overmolded lead frame assembly for pressure sensing applications
  • Overmolded lead frame assembly for pressure sensing applications

Examples

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Embodiment Construction

[0019] The present disclosure describes a process of forming an overmolded leadframe assembly for pressure sensing applications and a pressure sensing package including the overmolded leadframe assembly. A pressure sensing package according to the present disclosure has a thermoset epoxy overmolded construction of a lead frame assembly. In some embodiments, the lead frame assembly has an ASIC (eg, an ASIC with signal conditioning circuitry) attached to the lead frame. The process of the present disclosure addresses the problem of the thermoset epoxy's tendency to resin flash over the lead frame during the molding process, including wire bond pads that should be cleaned to prevent wire bond lift.

[0020] During the molding process, double-sided clamping of the lead frame protects the wire bond pads on the first side of the lead frame (also referred to herein as the "top side") from resin flash, but can cause Unnecessary exposure of the second side (also referred to herein as ...

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PUM

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Abstract

The disclosure relates to an overmolded lead frame assembly for pressure sensing applications. The process of forming an overmolded lead frame assembly for a pressure sensing application includes clamping both sides of a lead frame to performing a primary overmolding operation to prevent resin flash on wire bonding areas on the lead frame. The process also includes performing the primary overmolding operation to form a primary mold that covers selected portions of the lead frame on first and second sides of the lead frame assembly. The primary mold forms an electronics cavity on the first sideof the lead frame assembly to enable subsequent wire-bonding of a microelectromechanical system (MEMS) pressure sensing element to the wire bonding areas. The process further includes performing a secondary overmolding operation to form a secondary mold on the second side of the lead frame assembly. The secondary mold covers an exposed portion of the lead frame beneath the wire bonding areas.

Description

technical field [0001] The present disclosure relates to lead frame assemblies, and more particularly to lead frame assemblies used in pressure sensing applications. Background technique [0002] Packages with leadframes are known to be cost-effective, primarily due to their high bulk density. A lead frame can be used as a conductor to electronically connect the sensing element to the electronics. Wire bonding, as one of the methods used to connect the sensing element to the lead frame, must be contamination-free and include no resin flash / spill. Thermosetting epoxies have good adhesion to the leadframe but are prone to resin flashing, which can be prevented by clamping the sides of the leadframe. Double-sided clamping allows for a resin-free area on the wire-bonding surface, but leaves the other side unprotected. In some applications, such as differential pressure sensing applications, an unprotected lead frame can be attacked when exposed to harsh environments such as e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/00G01L19/00H01L21/48H01L23/495
CPCG01L1/00G01L19/0061H01L21/4821H01L23/49541G01L19/148G01L19/143G01L19/0627B81C1/00309B81B2201/0264B81C2203/0154H01L2924/19105H01L23/3135H01L23/293H01L23/481H01L24/46G01L19/0084G01L19/142B81B7/0058B81B7/007B81B2207/015B81B2207/097B81C1/00301B81C2203/0792G01L13/06G01L19/0069H01L24/48H01L2224/48245H01L2924/1433H01L2924/1461
Inventor 尤恩·H·贝尔戴维·T·布朗安德鲁·C·赫伦
Owner SENSATA ELECTRONIC TECH CO LTD
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