Heat dissipation device for IGBT module

Abstract

The invention provides a heat dissipation device for an IGBT module, which comprises a main heat radiator (1) and an auxiliary heat radiator (2), wherein the main heat radiator (1) is internally provided with two first low-melting-point metal flow channels (113) with opposite flow directions, and the main heat radiator (1) is provided with a first end surface in contact with an IGBT module (8); and the inlet of the auxiliary heat radiator (2) is communicated with outlets of the two first low-melting-point metal flow channels (113), and the outlet of the auxiliary heat radiator (2) is communicated with inlets of the two first low-melting-point metal flow channels (113) through a driving structure (3). The two first low-melting-point metal flow channels with opposite flow directions are arranged in the main heat radiator, so that the heat dissipation of the IGBT device with a high heat flux density is more balanced; by arranging the auxiliary heat radiator, the high-temperature low-melting-point metal working medium flowing out of the main heat radiator can be cooled.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic products, in particular to a heat dissipation device for an IGBT module. Background technique [0002] IGBT (Insulated Gate Bipolar Transistor), an insulated gate bipolar transistor, is a composite fully-controlled voltage-driven power semiconductor device composed of BJT (bipolar transistor) and MOS (insulated gate field effect transistor), and has a MOSFET The advantages of high input impedance and low conduction voltage drop of GTR. IGBT combines the advantages of the above two devices, not only has low driving power, but also has low saturation voltage, so it is widely used in inverter systems such as AC motors, frequency converters, switching power supplies, lighting circuits, traction drives and other fields. [0003] The high-power IGBT module has a large capacity, and the on-off current is also large. The performance of the cooling system will directly affect the pe...

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Problems solved by technology

[0006] Therefore, the technical problem to be solved by the present invention is to overcome the defects of uneven heat dissipation of low-melting-point metal radiators in the prior art, thereby providing a heat dissipation device for IGBT modules, so that the heat dissipation of IGBT devices with high heat flux density is more balanced , thereby improving the reliability and life of the high-power IGBT module

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