Heat-conducting insulating material mixed with epoxy resin and used for air-core reactor, and preparation method of heat-conducting insulating material
A technology of heat-conducting insulating materials and air-core reactors, which is applied in the field of heat-conducting insulating materials, can solve the problems of high temperature of insulating materials, complicated preparation process, burning of insulating materials, etc., and achieve the goal of ensuring insulation and thermal conductivity, simple operation and simplified operation Effect
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2019-12-17
- Estimated Expiration
- Not applicable · inactive patent
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Figure 1
Abstract
Description
technical field
[0001] The invention relates to the technical field of thermally conductive insulating materials for reactors, in particular to a thermally conductive insulating material for air-core reactors mixed with epoxy resin and a preparation method thereof. Background technique
[0002] In the prior art, the insulating material selected for the reactor is mainly epoxy resin, which is packaged by high temperature curing method, but due to poor thermal conductivity, it can only be used for low workload, low ambient temperature and stable working environment. Occasions, otherwise it is easy to cause the internal temperature of the insulating material to be too high and burn the insulating material itself.
[0003] In response to the above defects, epoxy resin materials with high insulation and thermal conductivity have appeared in the prior art. However, surface-modified inorganic fillers need to be added to the epoxy resin materials, the preparation process is complica...
Examples
Embodiment 1
[0026] According to the mass fraction of 1.1:1.0:2.0, aluminum nitride, silicon nitride, and magnesium oxide are mixed to form an inorganic component, and then the inorganic component, bisphenol A epoxy resin, and phthalic anhydride are mixed according to the mass fraction Mix 15:100:50 and heat to 100°C, stir under 50kPa negative pressure for 20min, after casting, carry out segmental curing at 160°C for 6h to obtain thermally conductive insulating material A.
Embodiment 2
[0028] According to the mass fraction of 1.0:1.0:2.0, aluminum nitride, silicon nitride, and magnesium oxide are mixed to form an inorganic component, and then the inorganic component, bisphenol A epoxy resin, and phthalic anhydride are mixed according to the mass fraction Mixed at 15:100:50 and heated to 100°C, stirred for 20min under 50kPa negative pressure, after casting, cured in sections at 160°C for 6h to obtain thermally conductive insulating material B.
Embodiment 3
[0030] According to the mass fraction of 1.0:1.0:2.0, aluminum nitride, silicon nitride, and magnesium oxide are mixed to form an inorganic component, and then the inorganic component, bisphenol A epoxy resin, and phthalic anhydride are mixed according to the mass fraction Mixed at 15:100:50 and heated to 100°C, stirred for 20min under 50kPa negative pressure, after casting, cured in sections at 180°C for 8h to obtain thermally conductive insulating material C.
[0031] Table 1 The performance table of the thermally conductive insulating material obtained by comparative examples of the present invention and each embodiment
[0032]
[0033] As can be seen from the table, through the comparison of Comparative Examples and Examples 1-3, it can be seen that the thermal conductivity and resistivity of the thermally conductive insulating material obtained by the preparation method provided by the present invention at 30 ° C are higher than those without adding inorganic groups. ...