Spin coating equipment for uniformly coating photoresist on surface of super-large and super-heavy substrate

Abstract

Spin coating equipment for uniformly coating a photoresist on the surface of a super-large and super-heavy substrate comprises a spin coating host, a sample loading and unloading system and a master control system, and is mainly composed of an air floatation turntable, a sealed cavity, a photoresist uniformizing turntable, an automatic photoresist dripping system, a sample loading and unloading system and a console. The air floatation turntable with the automatic dynamic balance adjusting function is the key point of the equipment; the photoresist uniformizing turntable adopts a circle fillingmethod to reduce the influence of irregular airflow generated during rotation of a square substrate on the coating uniformity as much as possible; and the sample loading and unloading system is usedfor ensuring that the super-large and super-heavy substrate is safely loaded on and unloaded from a gluing machine station. The equipment disclosed by the invention can meet the requirement of a photoresist coating process on the surface of a substrate with the diameter of about 2m and the weight of about 700kg, and the photoresist coating non-uniformity in a clear aperture is superior to + / -3%.

Description

technical field [0001] The invention relates to the field of ultra-precision optical manufacturing, in particular to a spin-coating device for uniform coating of photoresist on the surface of a super-large and super-heavy substrate (with a maximum diameter of nearly 2m, a weight of about 700kg, and downward compatibility). Background technique [0002] The development of pulse width compression gratings promotes the application of chirped pulse amplification technology in ultra-short and ultra-intensive laser systems. As the output power of the laser system increases to the order of several petawatts, tens of petawatts or even hundreds of petawatts, due to the limitations of materials and processes, it is difficult to improve the anti-laser damage ability of gratings in a short period of time. Therefore, The only way to keep expanding the beam aperture is to reduce the laser energy density irradiated on the surface of the grating below the damage threshold of the grating, so...

AI Technical Summary

Problems solved by technology

However, for a long time, the largest wafer size in the semiconductor industry is only 12 inches, and there is no need for uniform coating of photoresist on the surface of such a large / overweight substrate

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