Chip fan-out type packaging structure and packaging method

Abstract

The invention provides a chip fan-out type packaging structure and a packaging method. The method comprises the following steps of: A, respectively arranging a first packaging layer on each chip in aplurality of chips, and enabling the first packaging layer to wrap a plurality of surfaces except the contact surface of the corresponding chip, B, arranging a bonding glue layer on a carrier plate, bonding the plurality of chips to the bonding glue layer and enabling the contact surface of each chip to be connected with the bonding glue layer, C, arranging a second packaging layer on the bondingglue layer and enabling the second packaging layer to wrap the plurality of chips and the corresponding first packaging layers so as to form a preliminary packaging structure, and D, removing the bonding glue layer from the preliminary packaging structure so as to unload the carrier plate, arranging a dielectric material layer and a metal circuit layer on the preliminary packaging structure, and electrically connecting the metal circuit layer with an input / output port of the chip. The method has the beneficial effects that plastic deformation is avoided, and the product yield can be increased.

Description

Technical field [0001] The invention relates to the field of chip packaging, in particular to a chip fan-out packaging structure and packaging method. Background technique [0002] With the rapid development of modern electronic information technology, electronic products are developing in the direction of miniaturization, portability, and multifunction. Electronic packaging materials and technology make electronic devices ultimately become functional products. A variety of new packaging materials, technologies and processes have been developed. Electronic packaging is working with electronic design and manufacturing to jointly promote the development of an information society. [0003] In the chip packaging structure, due to the matching problem of the thermal expansion coefficient between the chip and the plastic packaging material, the stress of the adjustment package device is unbalanced, and then plastic deformation of the chip occurs, ensuring the smooth progress of the pac...

AI Technical Summary

Problems solved by technology

[0003] In the chip packaging structure, due to the matching of the thermal expansion coefficient between the chip and the plastic packaging material, the stress imbalance of the packaging device is adjusted, and then the plastic deformation of the chip occurs, ensuring the smooth progress of the packaging process, resulting in a low product qualification rate.

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