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Filter surface grounding device and method

A grounding device and filter technology, applied in the field of filters, can solve the problems of out-of-band suppression and isolation of filters, and achieve the effects of improving out-of-band suppression, simple welding and uniform welding.

Pending Publication Date: 2020-01-10
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a filter surface grounding device and method, aiming to solve the problems of out-of-band suppression and poor isolation after the filter is installed in the prior art

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  • Filter surface grounding device and method
  • Filter surface grounding device and method
  • Filter surface grounding device and method

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Embodiment Construction

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0033] see figure 1 , the filter surface grounding device provided by the present invention will now be described. The filter surface grounding device includes a grounding box body 1 with an open top surface, a cover plate 2 closed and connected to the top surface of the grounding box body 1, and an elastic conductive component 3; wherein, the inner bottom surface of the grounding box body 1 is used for Adhesive circuit board 6, the upper surface of circuit board 6 is used for welding filter 5; In the open state, the other end of the elastic conductive component ...

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Abstract

The invention provides a filter surface grounding device and method, and belongs to the technical field of filters. The filter surface grounding device comprises a grounding box body with an open topsurface, a cover plate connected with the top surface of the grounding box body in a closed manner, and an elastic conductive assembly. The inner bottom surface of the grounding box body is used for bonding a circuit board; the upper surface of the circuit board is used for welding a filter; one end of the elastic conductive assembly is welded to the upper surface of the filter; the other end of the elastic conductive assembly extends out of the top surface of the grounding box body when the top surface of the grounding box body is in an open state that the cover plate is not connected; and when the grounding box body is in a closed connection state with the cover plate, the other end of the elastic conductive assembly is compressed into the grounding box body and abuts against the plate surface of the cover plate. The filter surface grounding device provided by the invention is high in out-of-band rejection degree and isolation degree. The invention further provides a filter surface grounding method based on the filter surface grounding device.

Description

technical field [0001] The invention belongs to the technical field of filters, and more specifically relates to a filter surface grounding device and method. Background technique [0002] At present, filters mainly include passive filters, dielectric filters, cavity filters, and SAW filters. The structure of the filter is usually as follows: it is surrounded by a layer of conductive material, leaving only the input and output ports, and the conductive material covering the filter is used for grounding and shielding the signal. This structure needs to install the filter on the circuit board by welding first, and then put it into the corresponding shielding box for use. [0003] In the process of realizing the present invention, the inventor found that there are at least the following problems in the prior art: because the microwave signal has high requirements for the consistency of the reference ground, the distance between the upper surface of the filter and the lower sur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H01P1/20
CPCH05K9/0064H01P1/20
Inventor 尹朝卿王朋李成凯李枫张皓韦雪真张广显石景格单亮崔成林张超曹翠娇杨建春贾倩倩
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP