High-heat-flux electronic component constant-temperature liquid cooling plate

Abstract

A high-heat-flux electronic component constant-temperature liquid cooling plate comprises an upper cooling plate, a liquid cooling mechanism and a lower cooling plate which are stacked in sequence, after stacking, a concave cavity of the upper cooling plate and a concave cavity of the lower cooling plate are oppositely combined to form a constant-temperature cavity surrounding the two sides of theliquid cooling mechanism, and a solid-liquid phase change heat storage mechanism is arranged in the constant-temperature cavity; the liquid cooling mechanism comprises a liquid cooling plate body anda connecting pipe body, the liquid cooling plate body comprises multiple paths of parallel pipe body parts, the head ends and the tail ends of the pipe body parts penetrate the connecting pipe body and are integrally welded, and the connecting pipe body is provided with multiple plugs at intervals, so that the multiple paths of parallel pipe body parts communicate end to end to form an S-shaped cooling path; and the solid-liquid phase change heat storage mechanism comprises a solid-liquid phase change heat storage material which is in gapless direct contact with the inner wall of the concavecavity in a solid state or a liquid state. The high-heat-flux electronic component constant-temperature liquid cooling plate can keep the long-term temperature of a power battery below the melting point of a solid-liquid phase change material, the temperature rise rate is low, and the temperature difference of all parts is small.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic components, in particular to a constant temperature liquid cooling plate for high heat flux density electronic components. Background technique [0002] Since the advent of the transistor in 1947, electronic components have developed rapidly, and more and more power and smaller and smaller volumes are the trend. This high level of integration has resulted in a large number of high heat flux electronic devices. Excessive junction temperature of electronic devices with high heat flux will lead to failure of electronic devices. When the operating temperature increases by 2°C, the reliability will decrease by 10%. Therefore, the reliability of electronic equipment with high heat flux needs to be guaranteed by cooling technology. The so-called high heat flux refers to the heat flux greater than or equal to 100W / cm 2 . For example, take a high-performance multi-core CPU as an ...

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Problems solved by technology

[0006] 2) When the heat flux is high, the temperature rise suppression performance of the liquid cold plate is poor

Although such a liquid-cooled plate solves the problem of "small heat dissipation area, weak rigidity, complicated assembly, and easy leakage of weld seam after long-term use", the production of such a structural aluminum material requires a special extrusion die, which is costly and relatively heavy. Heavy, the one-piece extruded aluminum also has a weld seam with the side solid plate, and the weld seam will also corrode the leakage after long-term use

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