Production process of hot-pressing tympan paper taking pressing copper-clad plate as cushion layer as well as application of hot-pressing tympan paper

Abstract

Hot-pressing tympan paper taking a pressing copper-clad plate as a cushion layer takes natural-color needlebush pulp, natural-color broadleaf wood pulp and kraft paper leftover materials as fiber rawmaterials; short fiber free pulping is adopted; the current of a pulping machine, the beating degree and the wet weight are controlled; finally, the quantity is 192+ / -4 g / m<2>, the thickness is 0.320+ / -0.02 mm, the tensile strength is more than or equal to 10 KN / m, the air permeability is more than or equal to 10 [mu]m / pa*s, the folding resistance is more than or equal to 10 times, the water-absorbing property is more than or equal to 100 mm / min, and the tightness is controlled to 550 to 600 kg / m<3>. Through cell cavity filling, on one hand, the fiber raw materials are reduced and the cost isgreatly saved; and on the other hand, fillers are added into the cell cavities, so the paper strength is not influenced. Therefore, the hot-pressing tympan paper has double advantages of improving theproperties of the tympan paper and reducing the cost.

Description

technical field [0001] The invention belongs to the field of pulping and papermaking, and relates to a production process of special industrial paper, in particular to a production process and application of hot-pressed backing paper for pressing copper-clad laminates as a backing layer. Background technique [0002] Hot-pressed backing paper is mainly used as a backing layer in the process of pressing copper clad laminates. When the vacuum press presses the plate, the surface needs to be covered with a layer of buffer pad, which can buffer the pressure and transmit the temperature during the pressing process, so as to achieve the effect of equal pressure and temperature. The temperature and pressure of the pressing can be more evenly transmitted to the surface of the processed copper clad laminate blank, ensuring that the copper clad laminate has no defects in appearance quality, uniform internal performance, and meets the required performance standards. At present, the pe...

AI Technical Summary

Problems solved by technology

The commonly used buffer pad is a sponge pad, but the sponge pad has the following disadvantages: the heat transfer speed of the sponge pad is slow, the price is high and it is not easy to buy, and the thickness is thick

Although there are also cushions made of fiber paper on the market, their physical strength and heat and pressure resistance are insufficient, and it is difficult to balance them. They can only be used in low-end copper clad laminates, and the number of uses is extremely limited. To meet the needs of the market and production, and due to the high cost of fibers, the pressure on the production cost of enterprises is huge

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