Universal Device for Ball Grid Array Device Planting

A ball grid array and general-purpose device technology, which is applied in the manufacturing of semiconductor devices, electric solid-state devices, and semiconductor/solid-state devices, etc., can solve the problems of high operator requirements, delayed production schedule, and missing solder balls, and achieves a simple structure of the device. Realize the effect of fast missing installation and improve production efficiency
CN110729206BActive Publication Date: 2021-06-1110TH RES INST OF CETC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
10TH RES INST OF CETC
Publication Date
2021-06-11

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Abstract

The invention discloses a ball-planting device for a ball grid array device, which aims to provide a ball-planting device with strong practicability, flexible and convenient operation, and good versatility. The present invention is realized through the following technical scheme: the ball planting pool of the inner cavity frame of the ball planting table is equipped with a lifting support block that drives the ball grid array device substrate to rise / fall synchronously and a main clamping slider that slides along the chute on both sides of the length of the frame mouth, And the auxiliary clamping slider that slides along the wide-side suspension beam slide rail; the two main clamping sliders move horizontally synchronously toward or against each other through the horizontal relative linkage mechanism connected to the horizontal adjustment knob below it, and the two auxiliary clamping sliders also The slider moves vertically and synchronously in the opposite direction or backward direction through the longitudinal relative linkage mechanism connected to the longitudinal adjustment knob below it; the solder balls fall on the pin pads of the ball grid array device substrate through the leakage holes of the solder ball leakage net, and control the time of ball planting. The number of solder balls falling on the pin pads of the ball grid array device substrate through the leakage mesh holes realizes the solder ball skipping of the ball grid array devices with different solder ball numbers.
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Description

technical field

[0001] The invention relates to the technical field of electronic packaging, in particular to a ball planting device for ball grid array packaging devices. Background technique

[0002] The ball grid array package (hereinafter referred to as BGA) makes an array of solder balls on the bottom of the package substrate as the I / O terminal of the circuit to interconnect with the printed circuit board PCB, which improves the placement yield and potentially reduces the cost; BGA packaged devices are in The bottom surface of the substrate is made of spherical contact pins in an array, which has the advantages of short pins, small lead inductance and capacitance; many pins, high ratio of the number of terminals to the size of the device package; large center-to-center spacing of solder joints, firm pins, and common Good surface performance and high assembly yield; the contact surface between the array solder ball and the substrate is large, which shortens the signal t...

Claims

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