High-performance temperature control system for LED wire bonder

Abstract

The patent provides a high-performance temperature control system for an LED wire bonder, comprising, in heating blocks, a plurality of heating bars, wherein a temperature sensor is disposed between the heating blocks to collect temperature data of the heating blocks; a controller comprising a PID module, wherein according to a given temperature value and an actual output temperature value, a temperature control deviation parameter is formed and deviations constitute a control amount through linear combination according to proportions, integral and differentiation; a fuzzy module, wherein fuzzy processing is performed on the temperature control deviation parameter according to an assignment table of membership grade of each fuzzy sub-set; and a fuzzy inference module, wherein according tothe parameter after being fuzzy processed, a PID module is obtained through inference to acquire correction parameters of proportions, integral and differentiation of deviations. A heating bar drivercontrols heating bars which are heated fast according to the control amount after being corrected with correction parameters. Defects in temperature control of the wire bonder with adoption of PID control is overcome, so as to enhance dynamic and static characteristics of the system and improve adaptation and robustness of the system.

Description

technical field [0001] This patent belongs to the technical field of wire bonding machines, and in particular relates to a high-performance temperature control system for LED wire bonding machines. Background technique [0002] LED wire bonding machine is a key semiconductor equipment that connects chip pads and package pins with metal leads. The principle of hot-press ultrasonic metal bonding is: heat and apply ultrasound to the metal wire and the pressure soldering point at the same time, the contact surface will produce plastic deformation, and destroy the oxide film on the interface to activate it, through the contact surface between the two metals Interdiffusion to complete the connection. Bonding temperature is an essential condition for metal bonding. If the bonding temperature is too low, the metals cannot be activated to complete the bonding, and if the bonding temperature is too high, the deformation between the materials will be aggravated, which will affect the...

AI Technical Summary

Problems solved by technology

[0005] This patent is proposed based on the above-mentioned requirements of the prior art. The technical problem to be solved in this patent is to provide a high-performance temperature controller for an LED wire bonding machine. The LED wire bonding machine using this temperature controller can effectively It effectively solves the shortcomings of the traditional temperature control device, such as uneven temperature distribution on the surface of the heating block, long waiting time for heating, and large overshoot in the adjustment process, and at the same time improves its production capacity and process indicators

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