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172results about How to "Increased current capability" patented technology

Optimal two-vector combination-based model predictive control method and system

The invention discloses an optimal two-vector combination-based model predictive control method and system. The method is applied to a permanent-magnet synchronous motor control system driven by a three-phase two-level inverter. A model predictive current control strategy is adopted, all two-vector combinations and resultant vector sets obtained under action time are considered at the same time, and a cost function is inspected and an optimal resultant vector is selected from all to-be-selected sets. In order to simplify the optimization process, an equivalent voltage equation is given, a sector transformation method is provided and to-be-selected two-vector combination sets are transformed into multiple fixed line segments; and a fast algorithm is given and partial complicated calculation is transformed to offline execution, so that the real-time calculated amount of the novel method is effectively reduced. The model predictive control method disclosed by the invention is simple in structure, small in real-time calculated amount and easy to implement; and the response speed of a motor is high, current ripples and distortion are small, the switching frequency is low and the dynamic and static performance of the system is excellent.
Owner:HUAZHONG UNIV OF SCI & TECH

Enhanced silicon carbide MOSFET device and manufacturing method thereof

The invention discloses an enhanced silicon carbide MOSFET device. The enhanced silicon carbide MOSFET device sequentially comprises back metal, an N+ type heavily doped SiC substrate, an N- epitaxiallayer, an insulating dielectric layer and front metal from bottom to top. According to the invention, a Schottky diode is integrated into the MOSFET device, and the area of a Schottky barrier metal layer is flexibly increased or decreased to adjust and adapt to the current and specification of the MOSFET and the Schottky diode, so that the effects of increasing the switching speed of the MOSFET,reducing the switching loss and the like are achieved, the performance and the reliability of the device can be greatly improved, and the application cost of the device is reduced. The enhanced silicon carbide MOSFET device adopts a trench SiC MOSFET design, and a conductive channel is changed from the traditional horizontal direction to the vertical direction, so that a JFET effect between primitive cells of the traditional MOSFET is eliminated, and the current capability of the device is improved. The gate bottom P region at the bottom of the trench can protect and weaken an electric field at the bottom of the trench, thereby playing a certain role in electrostatic shielding of gate oxide at the bottom of the trench, and improving the reliability of the device. Meanwhile, certain help isprovided for voltage resistance of the device.
Owner:SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA

Transverse signal operation instruction (SOI) power device

The invention discloses a transverse signal operation instruction (SOI) power device. The transverse SOI power device comprises a semiconductor substrate, an insulating medium layer and a semiconductor active layer, wherein a body region and a drain region are arranged on the surface of the semiconductor active layer, an interval exists between the body region and the drain region to form a drift region of the device, a body contact region and a source region are sequentially formed on the surface of the body region, a silicon window is arranged on the insulating medium layer, the bottom of the body region is located in the silicon window or enters into the semiconductor substrate through the silicon window, the bottom of the body contact region enters into the silicon window, and a common leading-out end of the source region and the body contact region serves as a source electrode. The transverse SOI power device has the advantages that the body region is effectively led out, floating body effects of a Kink effect, a parasitic triode effect, memory effect and the like are eliminated, the off state withstand voltage and gate control capacity are improved, simultaneously the puncture voltage in an on state is boosted, characteristics of the SOI device are improved, and the possibility of a partial appendage effect appearing in a T-shaped gate structure and a base transceiver station (BTS) structure is eliminated.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

PVC (polyvinyl chloride) home decorative sheet and preparation method thereof

InactiveCN106380738AInhibition of premature decompositionAvoid breakingWeather resistanceFoaming agent
The invention discloses a PVC (polyvinyl chloride) home decorative sheet which is prepared from the following raw materials according to a weight proportion: 20 to 30 of PVC resin powder; 10 to 30 of colloidal calcium carbonate; 90 to 150 of PVC recycled materials; 1.5 to 2.0 of composite stabilizer; 6 to 9 of foaming control agent; 1 to 1.8 of composite foaming agent; 0.2 to 0.5 of plasticizer, 0.5 to 0.7 of internal lubricant, 0.1 to 0.3 of external lubricant, and 0.025 to 0.035 of whitening agent. The PVC recycled materials comprise a PVC decorative template recycled material, a white PVC plastic steel window recycled material and a white PVC pipe recycled material; the composite foaming agent is formed by mixing a white foaming agent and a yellow foaming agent. The invention further discloses a preparation method of the PVC home decorative sheet. According to the PVC home decorative sheet and the preparation method thereof, which are disclosed by the invention, the PVC recycled materials are used as one of the main raw materials, wastes are changed into treasures, production cost is reduced, energy is saved, hardness and weather resistance of the product are improved, recycling times are increased, the recycling times can reach 35 times or above, moreover, the preparation method is easy to operate, and the prepared product is smooth and attractive in surface. The PVC home decorative sheet disclosed by the invention is energy-saving, environmental-friendly, low in production cost and long in service life.
Owner:江苏旺科新材料有限公司

PVC (polyvinyl chloride) advertisement template and preparation method thereof

InactiveCN106349606AInhibition of premature decompositionImprove the finishWaxFoaming agent
The invention provides a PVC (polyvinyl chloride) advertisement template. The PVC advertisement template is prepared from, by weight, 60-90 parts of PVC resin powder, 20-50 parts of PVC reclaimed materials, 30-60 parts of active light calcium carbonate, 2.5-4 parts of compound stabilizer, 5-12 parts of foaming control agent, 1.2-2.25 parts of compound foaming agent, 0.2-0.6 part of plasticizer, 0.7-1.5 parts of lubricant, 0.3-1 part of titanium dioxide and 0.01-0.04 part of brightening agent, wherein the compound foaming agent is formed by mixing an inorganic foaming agent with an organic foaming agent, and the lubricant is formed by mixing PE wax, stearic acid and an internal lubricant ZB-60. The invention further provides a preparation method of the PVC advertisement template. The PVC advertisement template and the preparation method thereof have the advantages that since the PVC reclaimed materials are used as one of main raw materials, turning waste into wealth, production cost reduction and energy saving are achieved, hardness and weather fastness of the PVC advertisement template are improved, the number of recycling times can be increased and reach more than 35, and the PVC advertisement template is smooth and attractive in surface; the preparation method is easy to operate.
Owner:江苏旺科新材料有限公司

Novel differential- and common-mode filter inductance structure

The invention discloses a novel differential- and common-mode filter inductor structure. The filter inductor structure comprises a first magnetic core, a second magnetic core, a third magnetic core, afourth magnetic core, a first copper strip and a second copper strip, wherein the first magnetic core is attached onto the second magnetic core, a first through hole and a second through hole are simultaneously formed between the first magnetic core and the second magnetic core and communicate with each other via a first air gap, the third magnetic core is attached onto the fourth magnetic core,a third through hole and a fourth through hole are simultaneously formed between the third magnetic core and the fourth magnetic core and communicate with each other via a second air gap, the first copper strip and the second copper strip are used as windings, the first copper strip penetrates through the second through hole and the fourth through hole, and the second copper strip penetrates through the first through hole and the third through hole. The differential- and common-mode filter has the advantages of compact structure, high current through capability and good filtering performance,moreover, filtering characteristics can be configured, and modular expansion can be performed.
Owner:BEIJING INST OF SPACE LAUNCH TECH +1

Silicon on insulator-lateral insulated gate bipolar transistor (SOI-LIGBT) device structure with low switch-off loss and dual groove gates

The invention provides a silicon on insulator-lateral insulated gate bipolar transistor (SOI-LIGBT) device structure with low switch-off loss and dual groove gates. The SOI-LIGBT device structure comprises a P-type substrate, buried oxide layer SiO2, an N-type drift region, a P-type well region, an N-buffer layer, an oxide layer, two N-type source ends, a P-type contact region and an N-type positive electrode region, wherein the P-type contact region is arranged between the two N-type source ends, gate oxide layers are arranged at two sides of a channel between the source ends and the P-type well region, and poly-silicon is arranged aside the gate oxide layers and is arranged at two sides of the P-type well region and at a left side of the N-buffer layer. The SOI-LIGBT device structure possesses a dual-gate structure and has higher current capability under the same condition, holes directly injected to the P-type well region are reduced by the introduction of an N-type carrier storage layer, so that the carrier distribution is more uniform, the carrier combination during switch off is facilitated, and the switch-off time is reduced; the effective space of the N-type drift region is reduced by groove medium SiO2, the injection of carriers at a right side is also simultaneously blocked, and a carrier accumulation layer is formed; and based on two effects, the switch-off loss of the structure is substantially reduced.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA +1

IGBT module packaging structure of inverter

The invention discloses an IGBT module packaging structure of an inverter. The positive input end and the negative input end of each half-bridge IGBT module are respectively arranged on the lower surface of a chip. A buffer capacitor can be respectively welded on the surfaces of the positive input end area and the negative input end area on the surface of a first insulation ceramic substrate, thereby maximally eliminating pin inductance of the IGBT module through short-circuit. An E pole of an upper half-bridge IGBT chip and a C pole of the lower half-bridge IGBT chip of each half-bridge IGBT module are respectively arranged on the upper surface of the chip, and can be located far from a water cooling board, thereby reducing an equivalent parasitic capacitance, reducing earth common-mode interference current, and improving EMC performance of the inverter. A binding line of each phase half-bridge IGBT module is saved, thereby improving current capability and prolonging service life time, reducing chip area and lowering inverter cost. Electric pins of each phase half-bridge IGBT module are directly welded on the insulation ceramic substrate and a chip. The distances among the positive input end, the negative input end and phase output pin of each phase half-bridge IGBT module are small, thereby realizing short outlet wire of the inverter, simplifying wiring and ensuring no easy heating of an inner chamber by copper bars.
Owner:UNITED AUTOMOTIVE ELECTRONICS SYST

Double-gate SOI-LIGBT device with P-type buried layer

The invention relates to a semiconductor device and discloses a double-gate SOI-LIGBT device with a P-type buried layer. Under the condition that voltage resistance is ensured, the current capacity of the device is enhanced. According to the double-gate SOI-LIGBT device, the P-type buried layer is additionally arranged, traditional bulk silicon is changed into polycrystalline silicon for serving as filling materials of a separation groove, the separation groove is connected with a gate end electrode through a metal structure and accordingly serves as a gate electrode in the lateral direction of the device. The double-gate SOI-LIGBT device not only can serve as a gate field plate to be shrunk into an electric field near a channel region for meeting the voltage resistance requirement. Meanwhile, the double-gate SOI-LIGBT device can serve as a longitudinal gate electrode so that the current can stream on the surface and can also stream below the P-type buried layer in a device body area, the current capacity is enhanced, on-resistance is reduced, and therefore the size of the device in the width direction can be shortened under the condition that the voltage resistance is ensured. The double-gate SOI-LIGBT device with the P-type buried layer is suitable for a PDP scanning driving chip.
Owner:SICHUAN CHANGHONG ELECTRIC CO LTD
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