Electrostatic chuk system, film formation apparatus and method, suction method, and manufacturing method of electronic device

A technology of electrostatic chucks and adsorbents, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, electrical components, etc., and can solve problems such as mask wrinkles

Active Publication Date: 2020-02-11
CANON TOKKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the prior art, when the mask is adsorbed across the substrate by an electrostatic chuck, there is a problem that wrinkles remain on the mask after adsorption.

Method used

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  • Electrostatic chuk system, film formation apparatus and method, suction method, and manufacturing method of electronic device
  • Electrostatic chuk system, film formation apparatus and method, suction method, and manufacturing method of electronic device
  • Electrostatic chuk system, film formation apparatus and method, suction method, and manufacturing method of electronic device

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Embodiment Construction

[0029] Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the accompanying drawings. However, the following embodiments and examples are merely illustrative of preferred structures of the present invention, and the scope of the present invention is not limited to these structures. In addition, unless otherwise specified, the scope of the present invention is not limited to the hardware configuration and software configuration, processing flow, manufacturing conditions, dimensions, materials, shapes, etc. of the apparatuses in the following description.

[0030] The present invention can be applied to an apparatus for depositing various materials on the surface of a substrate to form a film, and can be preferably applied to an apparatus for forming a thin film (material layer) of a desired pattern by vacuum deposition. As the material of the substrate, an arbitrary material such as glass, a film of a polymer material, an...

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PUM

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Abstract

The invention provides an electrostatic chuk system, film formation apparatus and method, a suction method, and a manufacturing method of an electronic device. The electrostatic chuk system is used for sucking a to-be-sucked object and is characterized by comprising the electrostatic chuk, having an electrode unit and a suction surface for sucking the to-be-sucked object; an electric potential difference applying unit, which applies the electric potential difference to the electrode unit; a magnetic force generation unit, which is configured to the opposite side of the suction surface of the electrostatic chuk; and a driving mechanism which drives the magnetic force generation unit to move in a direction, including a first direction parallel to the suction surface of the electrostatic chuk.

Description

technical field [0001] The present invention relates to an electrostatic chuck system, a film forming device and method, an adsorption method and a manufacturing method of an electronic device. Background technique [0002] In the production of an organic EL display device (organic EL display), when forming an organic light-emitting element (organic EL element; OLED) constituting the organic EL display device, the vapor deposition material evaporated from the vapor deposition source of the film forming device is passed through The mask on which the pixel pattern is formed is vapor-deposited on the substrate to form an organic layer or a metal layer. [0003] In a film-forming apparatus of the upward vapor deposition method (up-deposition), the vapor deposition source is installed in the lower part of the vacuum vessel of the film forming apparatus, and the substrate is arranged on the upper part of the vacuum vessel, and vapor-deposits on the lower surface of the substrate. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24C23C14/04C23C14/12C23C14/50C23C14/54H01L51/56H10K99/00
CPCC23C14/24C23C14/042C23C14/50C23C14/54C23C14/12H10K71/164H10K71/166H10K71/00H01L21/6833H02N13/00B23Q3/15H01L21/02631
Inventor 柏仓一史石井博
Owner CANON TOKKI CORP
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