Method of drilling, positioning and manufacturing ultra-long multilayer board

A production method and multi-layer board technology, which is applied in the fields of printed circuit manufacturing, electrical components, printed circuits, etc., can solve the problems of restricting the development of the industry, unsatisfactory, and large parts, and achieve the effect of improving the matching degree

Inactive Publication Date: 2020-02-11
HUIZHOU KING BROTHER CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, in the printed circuit board industry, the components required for aerospace or lighting equipment are all too large, and some require a size of more than 40 inches. At present, the effective production table of the drilling rig in the industry cannot meet the production of this production size, which limits the development of the industry.

Method used

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  • Method of drilling, positioning and manufacturing ultra-long multilayer board

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A method for manufacturing super-long multi-layer board drilling positioning, characterized in that it comprises the following steps:

[0027] S1. Inner layer data design, design 1, 2, 3, 4, 5, 6, 7, 8 on the inner layer film, a total of eight positioning target hole graphics;

[0028] S2. After the lamination is completed, drill the corresponding 8 positioning target holes when shooting with X-Ray;

[0029] S3. Drilling data production, the overall drill belt is disassembled into 2 sections of drill belt, namely A section drill belt and B section drill belt, the A section drill belt uses No. Drilling belts are positioned using No. 4, 6, 7, and 8 positioning target holes;

[0030] S4. When drilling, firstly import the drilling tape data of section A to complete the production, and then import the drilling tape data of section B to replace the positioning target hole to complete the production of section B.

[0031] Further, in step S1, the positioning target hole 1 an...

Embodiment 2

[0044] A method for manufacturing super-long multi-layer board drilling positioning, characterized in that it comprises the following steps:

[0045] S1. Inner layer data design, design 1, 2, 3, 4, 5, 6, 7, 8 on the inner layer film, a total of eight positioning target hole graphics;

[0046] S2. After the lamination is completed, drill the corresponding 8 positioning target holes when shooting with X-Ray;

[0047] S3. Drilling data production, the overall drill belt is disassembled into 2 sections of drill belt, namely A section drill belt and B section drill belt, the A section drill belt uses No. Drilling belts are positioned using No. 4, 6, 7, and 8 positioning target holes;

[0048] S4. When drilling, firstly import the drilling tape data of section A to complete the production, and then import the drilling tape data of section B to replace the positioning target hole to complete the production of section B.

[0049] Further, in step S1, the positioning target hole 1 an...

Embodiment 3

[0062] A method for manufacturing super-long multi-layer board drilling positioning, characterized in that it comprises the following steps:

[0063] S1. Inner layer data design, design 1, 2, 3, 4, 5, 6, 7, 8 on the inner layer film, a total of eight positioning target hole graphics;

[0064] S2. After the lamination is completed, drill the corresponding 8 positioning target holes when shooting with X-Ray;

[0065] S3. Drilling data production, the overall drill belt is disassembled into 2 sections of drill belt, namely A section drill belt and B section drill belt, the A section drill belt uses No. Drilling belts are positioned using No. 4, 6, 7, and 8 positioning target holes;

[0066] S4. When drilling, firstly import the drilling tape data of section A to complete the production, and then import the drilling tape data of section B to replace the positioning target hole to complete the production of section B.

[0067] Further, in step S1, the positioning target hole 1 an...

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Abstract

The invention belongs to the technical field of circuit board processing, and provides a method of drilling, positioning and manufacturing an ultra-long multilayer board. The method comprises the following steps of: S1, designing inner-layer data and designing 1, 2, 3, 4, 5, 6, 7 and 8 positioning target hole patterns on an inner-layer film, S2, after completing lamination, drilling eight corresponding positioning target holes when X-Ray is used for targeting, S3, manufacturing drilling data, disassembling the whole drilling belt into two sections of drilling belts: a section A drilling belt and a section B drilling belt, enabling the section A drilling belt to use the first, the second, the third and the fifth positioning target hole for positioning, and enabling the section B drilling belt to use the fourth, the sixth, the seventh and the eighth positioning target hole for positioning, and S4, firstly importing the section A drilling belt data to complete production in the case of drilling and then importing the section B drilling belt data to replace the positioning target hole to complete production and manufacturing of the section B. Two or more sets of positioning target holes are drilled to drill holes in a segmented mode, drilling data are correspondingly disassembled into multiple sections of data in design, and drilling manufacturing of ultra-long boards can be achieved in the state of original equipment.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a manufacturing method for drilling and positioning superlong multilayer boards. Background technique [0002] Multilayer circuit board is the product of the development of electronic technology in the direction of high speed, multi-function and large capacity. With the continuous development of electronic technology, especially the extensive and in-depth application of large-scale and ultra-large-scale integrated circuits, multilayer circuit boards are rapidly developing towards high-density, high-precision, and high-level digitization. [0003] At present, in the printed circuit board industry, the components required for aerospace or lighting equipment are all too large, and some require a size of more than 40 inches. At present, the effective production table of the drilling rigs in the industry cannot meet the production of this production size...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0047
Inventor 周美繁胡样平聂兴培樊廷慧林鹭华
Owner HUIZHOU KING BROTHER CIRCUIT TECH
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