Heat dissipator
A heat sink and heat sink technology, applied in the direction of indirect heat exchangers, heat exchange equipment, electric solid devices, etc., can solve the problems that the heat of the heat pipe group cannot be fully uniformed, the cooling characteristics cannot be fully improved, and the cooling characteristics cannot be exerted. Improvement of cooling performance, prevention of increase in radiator size, and improvement of degree of freedom
Active Publication Date: 2020-02-11
FURUKAWA ELECTRIC CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
However, there is a problem that if the flat parts of the heat pipes are arranged side by side in the vertical direction, the heat receiving area of each heat pipe will be reduced, so the thermal resistance will increase, and sufficient cooling characteristics will not be exhibited.
[0007] As mentioned above, if the heat pipe group formed by a plurality of heat pipes is thermally connected to the heating body, the heat in the heat receiving part of the heat pipe group cannot be uniformed sufficiently, and the thermal resistance between the heat receiving part of the heat pipe group and the heat generating body increases, Therefore, the cooling characteristics cannot be sufficiently improved
Method used
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Examples
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Embodiment Construction
[0049] Hereinafter, a heat sink according to an embodiment example of the present invention will be described with reference to the drawings. figure 1 It is a schematic perspective view explaining the heat sink concerning the Example of this invention. figure 2 It is a schematic sectional view explaining the heat sink concerning the Example of this invention. image 3 It is a schematic explanatory drawing which shows the connection part of the heat-transfer member and a pipe body of the radiator concerning the Example of this invention. Figure 4 It is a schematic perspective view explaining the heat sink concerning the 2nd Embodiment of this invention. Figure 5 is a schematic plan view illustrating a heat sink according to a second embodiment of the present invention. Image 6 is a schematic front view illustrating a heat sink according to a second embodiment of the present invention. Figure 7 is a schematic perspective view illustrating a heat sink according to a third...
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The present invention provides a heat dissipator that can uniformly heat the heat-receiving portion and increase the volume of the heat-receiving portion. Moreover, even if the heat generation of theheat-generating body increases, the heat resistance of the heat-receiving portion can be prevented from increasing, thereby acheiving excellent cooling effect on a cooled object. The heat dissipator includes: a heat transfer member having a heat receiving portion thermally connected to the heating element; a pipe body connected to a heat insulation portion or a heat dissipation portion of the heattransfer member; and a cooling fin group which is in thermal contact with the pipe body and is connected and configured with multiple cooling fins. The heat transfer member has an integrated internalspace. The internal space communicates the heat receiving portion to a connection portion connected to the pipe body. A working fluid is sealed in the internal space. The internal space of the heat transfer member communicates with an internal space of the pipe body.
Description
technical field [0001] The present invention relates to a heat sink for cooling electric / electronic parts and the like, and particularly relates to a heat sink which can be installed in a narrow space. Background technique [0002] With the multifunctionalization of electronic equipment, heating elements such as electronic components are mounted at high density inside the electronic equipment. A fan heater can be used as a method of cooling a heat generating body such as an electronic component. As the heat sink, a heat sink including a tubular heat pipe (heat pipe type heat sink) is generally used. [0003] As a heat pipe type heat sink, for example, there is a heat pipe type heat sink provided with a plurality of flat fins protruding from the outer peripheral surface of a plurality of tubular heat pipes provided (Patent Document 1). The heat sink of Patent Document 1 is a heat sink configured to transfer heat from a heat generating body to fins through a plurality of tub...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K7/20H01L23/427F28D15/04F28F1/26
CPCF28D15/0266F28D15/04F28F1/26H01L23/427H05K7/20336H01L23/3672
Inventor 川田贤也佐佐木泰海渡边阳介
Owner FURUKAWA ELECTRIC CO LTD