Method for obtaining uniform coating of crystallizer copper plate based on finite element simulation

A crystallizer copper plate and uniform coating technology, applied in the direction of design optimization/simulation, CAD numerical modeling, etc., can solve the problem of not obtaining the best shielding position of the shielding plate, so as to improve the plating efficiency and plating uniformity, and reduce the plating The time, the effect of improving the success rate

Active Publication Date: 2020-02-14
ANHUI MA STEEL SURFACE TECH CO LTD
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Problems solved by technology

[0005] However, in the prior art, there is no plan to apply the shielding plate to the electroplating of the shaped billet mold to improve the quality of the electroplating, and there are no technicians to apply the shielding plate to the shaped billet Theoretical analys

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  • Method for obtaining uniform coating of crystallizer copper plate based on finite element simulation
  • Method for obtaining uniform coating of crystallizer copper plate based on finite element simulation
  • Method for obtaining uniform coating of crystallizer copper plate based on finite element simulation

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Embodiment Construction

[0036] In order to better understand the technical content of the present invention, specific embodiments are given together with the attached drawings for description as follows.

[0037] Aspects of the invention are described in this disclosure with reference to the accompanying drawings, which show a number of illustrated embodiments. The embodiments of the present disclosure are not defined to encompass all aspects of the invention. It should be appreciated that the various concepts and embodiments described above, as well as those described in more detail below, can be implemented in any of numerous ways, since the concepts and embodiments disclosed herein are not limited to any implementation. In addition, some aspects of the present disclosure may be used alone or in any suitable combination with other aspects of the present disclosure.

[0038] Based on the lack of shielding plates in the prior art, it may be applied to the electroplating process of the shaped billet...

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Abstract

The invention provides a method for obtaining a uniform coating of a crystallizer copper plate based on finite element simulation, and relates to the technical field of special-shaped blank crystallizer electroplating. The method utilizes finite element analysis software to simulate the situation of potential distribution on the surface of a crystallizer copper plate under the two working conditions of not arranging a shielding plate and arranging the shielding plate during crystallizer copper plate electroplating, analyzes the reason for poor uniformity of a crystallizer copper plate coating,analyzes the principle that the shielding plate arranged between the crystallizer copper plate and the anode is beneficial to improving the surface potential distribution of the crystallizer copper plate in the electroplating process, obtains the optimal shielding position, beneficial to uniformity of the crystallizer copper plate coating, of the shielding plate through analysis, enables an analysis simulation result to be effectively combined with actual production, and achieves a good using effect in actual application of crystallizer copper plate electroplating.

Description

technical field [0001] The invention relates to the technical field of mold electroplating for shaped billets, in particular to a method for obtaining a uniform coating of a mold copper plate based on finite element simulation. Background technique [0002] Shaped billet crystallizer is a key part of continuous casting production. With the development of continuous casting technology, the requirements for mold copper plate are getting higher and higher. Attaching a layer of wear-resistant coating on the surface of mold copper plate is to improve the use of mold copper plate. Necessary means of life. [0003] In the prior art, the working surface of the copper plate of the special-shaped blank crystallizer is a relatively typical irregular surface, as shown in the attached figure 1 As shown, more coatings will be deposited on the convex surface during the electroplating process, which makes the deposition on the concave surface very difficult and the coating is thin. In the...

Claims

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Application Information

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IPC IPC(8): G06F30/23G06F111/10
Inventor 杭志明王硕煜张龙丁贵军杨钧甘为民熊道毅刘香年张鹏飞
Owner ANHUI MA STEEL SURFACE TECH CO LTD
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