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60results about How to "Uniform potential" patented technology

Method for on-line detection of surface defects of metal arc-shaped workpiece

ActiveCN109682839AUniform potentialPotential value contrast is obviousMaterial analysis by optical meansLow contrastDefect region
The invention discloses a method for on-line detection of surface defects of a metal arc-shaped workpiece. The method comprises the steps: first, obtaining grayscale images of the surface of a metal arc-shaped workpiece and establishing a data field; if the maximum potential value of the data field is smaller than a set threshold, determining that the metal arc-shaped workpiece has no defect, ending the detection, if not, executing the next step; conducting threshold segmentation on the image data field to obtain a binary image B1W(x, y), and marking defect areas; then for each defect area, determining a contrast threshold T according to its externally connected rectangular area; then, calculating the contrast of any pixel inside the externally connected rectangle of each defect area, andconducting threshold segmentation according to the contrast and T pairs of grayscale images to obtain a binary image B2W(x, y); finally, uniting the B1W(x, y) and the B2W (x, y) and removing the noiseto obtain a final defect image, thereby detecting defects. The problem of low defect detection accuracy caused by uneven reflection, low contrast and many kinds of defects of the surface of the metalarc-shaped workpiece is effectively solved, and the method has good detection precision and robustness for detection of different defects.
Owner:716TH RES INST OF CHINA SHIPBUILDING INDAL CORP

Internal electrode for composite insulator and equalizing ring configuring method as well as composite insulator thereof

The invention relates to a method for improving the distribution of the electrical level of a composite insulator in a power transmission line and controlling an end electric filed thereof. According to the method, an inner electrode and an equalizing ring are arranged on the conducting wire side of the composite insulators for the high-voltage power transmission line; and the pole tower side is only provided with an inner electrode. The composite insulator formed by the method comprises an epoxy core bar with an umbrella skirt and a jacket covered outside, and hardware fittings on two ends; the conducting wire side of the core bar and a bar body of the pole tower side are respectively embedded with an inner slender electrode made of metal material; the conducting wire side of the core bar is provided with an equalizing ring which is made of the metal material and consists of a bracket and a ring; and the shape of the ring can be a cirque, an opening ring, an elliptical ring, etc. The method can realize the even distribution of the electric field of the conducting wire side and the pole tower side of the composite insulator, reduces the distribution of the electric levels on two sides, inhibits the corona discharge and electric deterioration of the composite insulator and improves the reliability of safe operation of an electric power system.
Owner:STATE GRID CORP OF CHINA

Semiconductor thermal expansion glass mat and production method thereof

The invention discloses a semiconductor thermal expansion glass mat and a production method thereof. The semiconductor thermal expansion glass mat is a multi-layer structure, which is characterized bycomprising a thermal expansion glass mat and semiconductor low resistance fabric; and at least one surface of the thermal expansion glass mat is compounded with the semiconductor low resistance fabric. The production method is characterized by comprising the procedures as follows: a. mixing glue; b. fully injecting glue liquid into a glue groove of a horizontal gluing machine; c. mounting the glass mat on the horizontal gluing machine and connecting the glass mat with guiding fabric; d. starting sizing; e. cutting; f. preheating an oil press for standby; g. tidily placing the glass mat according to required thickness to form a glass mat blank, and arranging interval spacers between each glass mat blank; h. pressing to obtain heat expansion glass mat; i. selecting proper semiconductor lowresistance fabric, and arranging the semiconductor low resistance fabric on the single surface or double surfaces of the thermal expansion glass mat; and j. thermally pressing the composite products of the thermal expansion glass mat and the semiconductor low resistance fabric to form the semiconductor thermal expansion glass mat. The semiconductor thermal expansion glass mat and the production method thereof can prolong the service life of a motor as well as save labor and time.
Owner:浙江博菲电气股份有限公司

Silicon carbide semiconductor device terminal and manufacturing method thereof

The invention relates to the power semiconductor technology field and discloses a silicon carbide semiconductor device terminal and a manufacturing method thereof. A terminal structure comprises a plurality of well region auxiliary rings, a junction terminal extension, a plurality of junction terminal auxiliary rings, a plurality of base region auxiliary rings and a passivation layer. The well region auxiliary rings are located outside a well region, the junction terminal extension is close to the well region, and a depth is smaller than that of the well region. The junction terminal auxiliaryrings are located on an outer side of the junction terminal extension, and the base region auxiliary rings are located on an outer side of the junction terminal auxiliary rings. By using less photoetching times and ion implantation times and through introducing the well region auxiliary rings, the junction terminal auxiliary rings and the base region auxiliary rings, electric field distribution of a high field region is optimized so that a blocking characteristic of the device is improved, and tolerance of a blocking voltage of the device to a terminal doping concentration is improved. The invention also provides a process method of using the terminal structure in a silicon carbide MOSFET device.
Owner:SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA

An integrated control method for anti-corrosion and anti-fouling of water jet propulsion channel system

The invention belongs to the technical field of ship corrosion and fouling prevention and relates to an anti-corrosion anti-fouling integrated control method for a flow channel system of a water-jet propeller. The method comprises the following steps: designing the anodic working area according to a polarization curve of total protection current and an anode, designing an embedded anodic structure pattern along water flow according to the characteristics of a flow channel structure, controlling a multi-channel switch type constant-potential instrument to output current based on a reference electrode B during operation of the flow channel system of the water-jet propeller, and enabling the cathodic protection potential of the flow channel to be -0.80V; detecting the anodic potential through a reference electrode A, controlling the flow channel system of the water-jet propeller to automatically adjust the output current, detecting the cathodic protection potential of the flow channel, and keeping operation of the flow channel system of the water-jet propeller when the potential is -0.80V to -1.05V through measurement, so that the anti-corrosion anti-fouling integrated control is realized. According to the method, a power supply is small in size, convenient to mount and environmentally friendly; the auxiliary anode is low in cost, long in service life, scouring-resistant, low in consumption rate, good in reliability and long in maintenance cycle; the potentials in the flow channel are uniformly distributed.
Owner:725TH RES INST OF CHINA SHIPBUILDING INDAL CORP

Method for obtaining uniform coating of crystallizer copper plate based on finite element simulation

The invention provides a method for obtaining a uniform coating of a crystallizer copper plate based on finite element simulation, and relates to the technical field of special-shaped blank crystallizer electroplating. The method utilizes finite element analysis software to simulate the situation of potential distribution on the surface of a crystallizer copper plate under the two working conditions of not arranging a shielding plate and arranging the shielding plate during crystallizer copper plate electroplating, analyzes the reason for poor uniformity of a crystallizer copper plate coating,analyzes the principle that the shielding plate arranged between the crystallizer copper plate and the anode is beneficial to improving the surface potential distribution of the crystallizer copper plate in the electroplating process, obtains the optimal shielding position, beneficial to uniformity of the crystallizer copper plate coating, of the shielding plate through analysis, enables an analysis simulation result to be effectively combined with actual production, and achieves a good using effect in actual application of crystallizer copper plate electroplating.
Owner:ANHUI MA STEEL SURFACE TECH CO LTD

Preparation method of al-cu-li-x aluminum-lithium alloy surface delithiation layer

The invention discloses a preparation method of a surface deintercalation layer of an Al-Cu-Li-X aluminium-lithium alloy. According to the method, by using a principle that lithium elements on the near-surface layer of the aluminium-lithium alloy are diffused to the surface of the alloy to carry out oxidization in the process of high-temperature heating, and a uniform deintercalation layer is formed on the near-surface layer of the alloy through controlling the heating temperature and the heat preservation time, so that the intergranular corrosion and the occurrence of exfoliation corrosion are effectively inhibited on the premise of not affecting the mechanical properties; and the method is also a necessary process of surface aluminium-clad rolling for aluminium alloys. The method comprises the steps of low-temperature long-period heat-preservation deintercalation treatment; and high-temperature solution treatment. An applicable aluminium-lithium alloy disclosed by the invention comprises the following components by weight percent: 2.0-5.0% of Cu, 0.8-2.5% of Li, 0.20-0.60% of Mn, 0.20-0.80% of Zn, 0.04-0.20% of Zr, 0.20-0.80% of Mg, 0.1-0.7% of Ag, less than or equal to 0.10% of Si, less than or equal to 0.10% of Fe, less than or equal to 0.12% of Ti, less than or equal to 0.05% of other single impurities, less than or equal to 0.15% of total impurities, and the balance of Al. According to the method, the corrosion resistance of Al-Cu-Li-X series alloys can be significantly improved.
Owner:AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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