Semiconductor thermal expansion glass mat and production method thereof

Abstract

The invention discloses a semiconductor thermal expansion glass mat and a production method thereof. The semiconductor thermal expansion glass mat is a multi-layer structure, which is characterized bycomprising a thermal expansion glass mat and semiconductor low resistance fabric; and at least one surface of the thermal expansion glass mat is compounded with the semiconductor low resistance fabric. The production method is characterized by comprising the procedures as follows: a. mixing glue; b. fully injecting glue liquid into a glue groove of a horizontal gluing machine; c. mounting the glass mat on the horizontal gluing machine and connecting the glass mat with guiding fabric; d. starting sizing; e. cutting; f. preheating an oil press for standby; g. tidily placing the glass mat according to required thickness to form a glass mat blank, and arranging interval spacers between each glass mat blank; h. pressing to obtain heat expansion glass mat; i. selecting proper semiconductor lowresistance fabric, and arranging the semiconductor low resistance fabric on the single surface or double surfaces of the thermal expansion glass mat; and j. thermally pressing the composite products of the thermal expansion glass mat and the semiconductor low resistance fabric to form the semiconductor thermal expansion glass mat. The semiconductor thermal expansion glass mat and the production method thereof can prolong the service life of a motor as well as save labor and time.

Description

technical field [0001] The invention relates to a semiconductor heat-expandable glass mat and a production method thereof, which is mainly used as a gasket material for motors, expands when heated, absorbs more paint by VPI, and has an insulation and heat-resistant grade of up to Class H (180°C). Background technique [0002] Originally, in order to achieve the anti-corona effect of the motor, thermal expansion glass mat is used in the middle of the groove and interlayer insulation, and the upper and lower sides are combined with three layers of semiconductor laminated glass cloth board. The thickness specification of the semiconductor laminated glass cloth board can be 0.5-0.8mm(±0.20mm); 1.0-1.5mm(±0.25mm); 1.8-2.0mm(±0.30mm); 2.5-3.0mm(±0.40mm); 3.5-4.0mm(±0.50mm), Density≥1.6g / cm 3 , surface resistance 1.0×10 3 -1.0×10 5 Ω. When the semiconductor laminated glass cloth board is used as the bottom liner of the motor slot or the liner between the layers, it must be proc...

AI Technical Summary

Problems solved by technology

When the semiconductor laminated glass cloth board is used as the bottom liner of the motor slot or the liner between the layers, it must be processed, cut, and ground according to the required size, which not only causes waste of materials, but also pollutes the environment with dust generated by cutting the grinding head, which is not conducive to Environmental friendly

Moreover, due to the combination of soft and hard, and patchwork of thickness, it will cause defects such as pad movement, resulting in poor operating reliability of the motor.

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