The invention relates to the technical field of Mini
LED packaging, in particular to a method for improving Mini
LED display ink
color consistency, which comprises the following steps: providing a PCB (
Printed Circuit Board) on which lamp surface and drive
welding is completed, and arranging a solder
resist ink layer and an LED
chip on the PCB; comprising the following steps that S1, the surface of a solder
resist ink layer is covered with a layer of black ink color forming
epoxy glue to be cured; s2, the surface of the LED
chip is filled with transparent
epoxy glue to be cured; and S3, the surface films of the black ink color forming
epoxy glue and the transparent epoxy glue are pressed with matt black glue films, and module packaging is completed after curing. According to the invention, a layer of black ink color forming epoxy glue is covered on the solder
resist ink layer of the PCB, and the black ink color forming epoxy glue completely covers the solder resist ink layer of the PCB, so that the surfaces of the same batch or different PCBs present a uniform black ink color optical effect, the blackening effect and
color consistency of the surfaces of the PCBs are improved, and the ink color background and the ink
color consistency required by the MiniLED module are provided.