Photo resist film removing agent

Abstract

A photoresist stripping of the membrane, which is composed of the percentage of weight: Composite organic base 10% - 30%; polyether active agent 1% to 5%; broken film of 1% to 5% copper Corrosion Inhibitor 0.1% -1%; deionized water 60 percent to 70 percent above base is a complex organic chemical-XR-NH2 organic amines in at least two, X is H, OH or NH2, R-n - base; polyether active agent for ethylene oxide and ethylene oxide to block copolymer or inorganic in at least one copolymer; broken film for the long carbon chain aliphatic amines, copper corrosion inhibitor for benzo triazole and its derivatives in at least one. The present invention retreat film properties, and its high rate of retreat membrane, the membrane of the retreat, the use of low-cost, Wuxi migration, copper corrosion, do not contaminate pure tin, gold, silver surface membrane retire at the metal layers with superior protection and particularly suitable for flexible lines and fine lines, and other high-end PCB manufacturing, production safety and environmental protection are used.

Description

technical field [0001] The invention relates to a photoresist stripping solution, which is a composition used for stripping the photoresist film from a substrate during the pattern transfer process of printed circuit manufacturing. Background technique [0002] Since the printed board industry introduced dry film photoresist (Dry Film Photoresist), dry film has become one of the important "imaging" technologies in the transfer of circuit graphics, whether it is a positive image or a negative image. It has good process performance, excellent imaging and chemical resistance. In the pattern electroplating process, it plays an important role in manufacturing fine wires, improving productivity, simplifying procedures, and improving product quality. less than the effect. The current water-soluble dry film can meet the needs of flexible circuit and fine circuit production, and can provide good resolution, corrosion resistance and anti-plating ability. [0003] The photoresist aft...

AI Technical Summary

Problems solved by technology

But it also has the following disadvantages: one is that it will attack the tin and copper plating, make it discolored, and stain the gold surface; The qualified rate of the finished product is low; the third is that the film slag produced when sodium hydroxide is used to remove the film is too large, it is difficult to filter, it is not suitable for machine retreat, and the film removal efficiency is low; the fourth is that the photoresist polymer in the dry film is due to the use of hydrogen oxidation Sodium dissolves into the waste film removal solution, which makes the waste liquid difficult to handle and has environmental protection problems; fifth, it is necessary to add additives such as Butyl Cellusolove (BCS) or triethanolamine to improve its effect on the dry film. Solubility performance, improve film removal effect, and butyl cellosolves are highly toxic substances