Ultraviolet LED packaging structure
A technology of LED packaging and ultraviolet light, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of high cost and complex process of ultraviolet light emitting diodes
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[0025] Please check Figure 1 to Figure 3 , UV LED packaging structure, including base 1, UV LED chip 2 and window 3.
[0026] The base 1 includes a substrate 11, such as a silicon-based material or a ceramic material, the top surface of the substrate 11 is provided with a top metal layer 12, the bottom surface of the substrate 11 is provided with a bottom metal layer 13, and the substrate 11 is provided with a through hole penetrating the top and bottom, and a conductive body 14 is additionally provided. The conductive body 14 is located in the through hole. The conductive body 14 is fixed and electrically connected to the top and bottom metal layers 12 and 13 to form a whole. In this embodiment: the top surface of the substrate 11 is provided with two top metal layers 12 spaced apart, an upper space 121 is formed between the two top metal layers 12, and the top surface of the substrate 11 is The Japanese-shaped area covered by the metal layer 12 (the two top metal layers 12 ar...
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