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Backlight assembly, backlight module and display panel

A technology of backlight assembly and backlight module, which is applied in the direction of optical components, optics, light guide, etc., to achieve the effect of improving heat dissipation capacity

Active Publication Date: 2020-02-21
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the heat dissipation problem of the existing Mini LED module, the present invention provides a backlight assembly, a backlight module and a display panel

Method used

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  • Backlight assembly, backlight module and display panel
  • Backlight assembly, backlight module and display panel
  • Backlight assembly, backlight module and display panel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] This embodiment provides a backlight assembly, such as image 3 As shown, it includes: a backplane 1 and a light source board 2. The backplane 1 is arranged on the side of the light source board 2 away from its light-emitting side, and also includes a shock absorber 3. The shock absorber 3 is arranged on the backplane 1 and the light source board 2. There is also a heat sink 4 between them, the heat sink 4 is arranged between the backboard 1 and the light source board 2, and the heat sink 4 extends from the side of the shock absorber 3 close to the light source board 2 to the side of the shock absorber 3 close to the backboard 1, the contact surfaces between the heat sink 4, the shock absorber 3, the back plate 1 and the light source plate 2 are bonded.

[0035] Wherein, the backplane 1 is made of a material capable of good heat dissipation, so that the heat inside the backlight assembly can be dissipated smoothly through it.

[0036] By setting the heat sink 4 extendi...

Embodiment 2

[0042] This embodiment provides a backlight assembly, and the difference from Embodiment 1 is that, as Figure 5 As shown, based on the backlight assembly in Embodiment 1, the backplane 1 includes heat dissipation fins 12 disposed on the side of the backplane 1 away from the light source board 2 .

[0043] Wherein, the heat dissipation fins 12 are made of the same material as the backplane 1 that can dissipate heat well. The arrangement of the cooling fins 12 can increase the surface area of ​​the backplane 1, so that the backplane 1 can better dissipate the heat generated when the light source board 2 provides backlight, and improve the heat dissipation efficiency of the backlight assembly.

[0044] Preferably, the heat dissipation fins 12 include multiple pieces, and the multiple pieces of heat dissipation fins 12 are arranged at equal intervals perpendicular to the backplane 1 . This is conducive to the efficient dissipation of heat.

[0045] In this embodiment, the cooli...

Embodiment 3

[0048] This embodiment provides a backlight module, which includes a light adjustment layer, and also includes the backlight assembly in Embodiment 1 or 2. The light adjustment layer is arranged on the light output side of the light source board in the backlight assembly, and is used to control the light emitted by the light source board. Adjustment.

[0049] Among them, the light adjustment layer includes light guide plates, diffusion sheets, quantum dot films, prisms, etc. stacked on each other. The light adjustment layer is a traditional film layer and structure, which will not be repeated here.

[0050] By adopting the backlight assembly in Embodiment 1 or 2 of the backlight module, the heat dissipation capability of the backlight module can be further improved, and at the same time, the heat dissipation energy consumption of the backlight module can be reduced and its heat dissipation consumables can be saved.

[0051] In this embodiment, when the light source on the ligh...

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PUM

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Abstract

The invention provides a backlight assembly, a backlight module and a display panel. The backlight assembly comprises a back plate and a light source plate, wherein the back plate is arranged on the side, away from the light emitting side of the light source plate, of the light source plate. The backlight assembly further comprises a damping part and a heat dissipation part, wherein the damping part is arranged between the back plate and the light source plate; the heat dissipation part extends from the side, close to the light source plate, of the damping part to the side, close to the back plate, of the damping part; and the contact faces of every two of the heat dissipation part, the damping part, the back plate and the light source plate are bonded. According to the backlight assembly,heat emitted when the light source plate provides backlight can be smoothly conducted to the back plate through the heat dissipation part, so that the situation that the light source plate is cooledby adopting active heat dissipation parts such as a fan is avoided, the energy consumption of the backlight assembly is reduced, the consumable of the backlight assembly is saved, and meanwhile the heat dissipation capacity of the backlight assembly is further improved.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to a backlight assembly, a backlight module and a display panel. Background technique [0002] Mini LED (also known as submillimeter light-emitting diode) is a new display technology in recent years, which has certain advantages over traditional LCD (liquid crystal display) and OLED (organic electroluminescence display). At present, with the development of Mini LED, heat dissipation has increasingly become the focus of research. [0003] Regardless of whether it is a Mini LED backlight module or a Mini LED display module, in the current conventional Mini LED design, the method of improving heat dissipation is mainly to use fans and other energy-consuming active heat dissipation components to dissipate heat from the Mini LED. These heat dissipation solutions will increase the energy consumption of the system and have problems such as replacement of consumables, and the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13357G02F1/1333
CPCG02F1/133603G02F1/133608G02F1/133385B82Y20/00G02B6/0051G02B6/0085G02B6/0093G02F1/133628G02F1/133314G02F1/13332G02B6/009G02F1/133308
Inventor 王世鹏
Owner BOE TECH GRP CO LTD